Zinc whisker growth from electroplated finishes – a review

L. Wu, M. A. Ashworth, G. D. Wilcox

    Research output: Contribution to journalReview article

    2 Citations (Scopus)
    2 Downloads (Pure)

    Abstract

    Tin whiskers are filamentary growths that are formed on the surface of electrodeposited tin, which is used extensively in the electronics industry. The presence of whiskers on electroplated finishes has been observed for more than 60 years, but, despite a huge amount of work in this area, a definite mechanism by which whiskers grow remains unidentified. Whiskers pose a significant problem for manufacturers of electrical and electronic equipment, since they are able to grow across and bridge the gap between adjacent electrical components, resulting in short-circuits and other associated failures. For many years, whisker growth was effectively mitigated by the addition of lead to tin electrodeposits. However, recent legislation prohibits the use of lead in new electrical and electronic devices, and thus alternative whisker reduction techniques are being sought. Effective mitigation is critical in ensuring that widespread whisker initiated failures can be avoided. However, since the mechanism, or mechanisms, which cause whisker growth remain unknown, the development of effective mitigation techniques is a significant industrial challenge, but a challenge which must be undertaken. This review examines some of the work undertaken to elucidate the whisker growth phenomenon. A brief history of whisker initiated failures along with key developments in whisker theory is presented. This is followed by a more detailed assessment of the several growth mechanisms hypothesised; dislocation-based, recrystallisation-based and compressive stress-based theories. The structure and properties of tin whiskers, along with factors that affect whisker growth and potential mitigation techniques are discussed.
    Original languageEnglish
    Pages (from-to)1-8
    Number of pages8
    JournalTransactions of the IMF
    Volume93
    Issue number2
    DOIs
    Publication statusPublished - 1 Apr 2015

    Fingerprint

    Zinc
    Tin
    zinc
    tin
    electronic equipment
    Electronics industry
    short circuits
    Compressive stress
    electronics
    Short circuit currents
    Electronic equipment
    Lead
    History
    industries
    histories
    causes

    Keywords

    • Whisker growth
    • Zinc
    • Review
    • Electrodeposition

    Cite this

    Zinc whisker growth from electroplated finishes – a review. / Wu, L.; Ashworth, M. A.; Wilcox, G. D.

    In: Transactions of the IMF, Vol. 93, No. 2, 01.04.2015, p. 1-8.

    Research output: Contribution to journalReview article

    Wu, L. ; Ashworth, M. A. ; Wilcox, G. D. / Zinc whisker growth from electroplated finishes – a review. In: Transactions of the IMF. 2015 ; Vol. 93, No. 2. pp. 1-8.
    @article{dd3ce621570c4ea89d7ed1095d4c672d,
    title = "Zinc whisker growth from electroplated finishes – a review",
    abstract = "Tin whiskers are filamentary growths that are formed on the surface of electrodeposited tin, which is used extensively in the electronics industry. The presence of whiskers on electroplated finishes has been observed for more than 60 years, but, despite a huge amount of work in this area, a definite mechanism by which whiskers grow remains unidentified. Whiskers pose a significant problem for manufacturers of electrical and electronic equipment, since they are able to grow across and bridge the gap between adjacent electrical components, resulting in short-circuits and other associated failures. For many years, whisker growth was effectively mitigated by the addition of lead to tin electrodeposits. However, recent legislation prohibits the use of lead in new electrical and electronic devices, and thus alternative whisker reduction techniques are being sought. Effective mitigation is critical in ensuring that widespread whisker initiated failures can be avoided. However, since the mechanism, or mechanisms, which cause whisker growth remain unknown, the development of effective mitigation techniques is a significant industrial challenge, but a challenge which must be undertaken. This review examines some of the work undertaken to elucidate the whisker growth phenomenon. A brief history of whisker initiated failures along with key developments in whisker theory is presented. This is followed by a more detailed assessment of the several growth mechanisms hypothesised; dislocation-based, recrystallisation-based and compressive stress-based theories. The structure and properties of tin whiskers, along with factors that affect whisker growth and potential mitigation techniques are discussed.",
    keywords = "Whisker growth, Zinc, Review, Electrodeposition",
    author = "L. Wu and Ashworth, {M. A.} and Wilcox, {G. D.}",
    year = "2015",
    month = "4",
    day = "1",
    doi = "10.1179/0020296715Z.000000000227",
    language = "English",
    volume = "93",
    pages = "1--8",
    journal = "Transactions of the IMF",
    issn = "0020-2967",
    publisher = "Taylor & Francis",
    number = "2",

    }

    TY - JOUR

    T1 - Zinc whisker growth from electroplated finishes – a review

    AU - Wu, L.

    AU - Ashworth, M. A.

    AU - Wilcox, G. D.

    PY - 2015/4/1

    Y1 - 2015/4/1

    N2 - Tin whiskers are filamentary growths that are formed on the surface of electrodeposited tin, which is used extensively in the electronics industry. The presence of whiskers on electroplated finishes has been observed for more than 60 years, but, despite a huge amount of work in this area, a definite mechanism by which whiskers grow remains unidentified. Whiskers pose a significant problem for manufacturers of electrical and electronic equipment, since they are able to grow across and bridge the gap between adjacent electrical components, resulting in short-circuits and other associated failures. For many years, whisker growth was effectively mitigated by the addition of lead to tin electrodeposits. However, recent legislation prohibits the use of lead in new electrical and electronic devices, and thus alternative whisker reduction techniques are being sought. Effective mitigation is critical in ensuring that widespread whisker initiated failures can be avoided. However, since the mechanism, or mechanisms, which cause whisker growth remain unknown, the development of effective mitigation techniques is a significant industrial challenge, but a challenge which must be undertaken. This review examines some of the work undertaken to elucidate the whisker growth phenomenon. A brief history of whisker initiated failures along with key developments in whisker theory is presented. This is followed by a more detailed assessment of the several growth mechanisms hypothesised; dislocation-based, recrystallisation-based and compressive stress-based theories. The structure and properties of tin whiskers, along with factors that affect whisker growth and potential mitigation techniques are discussed.

    AB - Tin whiskers are filamentary growths that are formed on the surface of electrodeposited tin, which is used extensively in the electronics industry. The presence of whiskers on electroplated finishes has been observed for more than 60 years, but, despite a huge amount of work in this area, a definite mechanism by which whiskers grow remains unidentified. Whiskers pose a significant problem for manufacturers of electrical and electronic equipment, since they are able to grow across and bridge the gap between adjacent electrical components, resulting in short-circuits and other associated failures. For many years, whisker growth was effectively mitigated by the addition of lead to tin electrodeposits. However, recent legislation prohibits the use of lead in new electrical and electronic devices, and thus alternative whisker reduction techniques are being sought. Effective mitigation is critical in ensuring that widespread whisker initiated failures can be avoided. However, since the mechanism, or mechanisms, which cause whisker growth remain unknown, the development of effective mitigation techniques is a significant industrial challenge, but a challenge which must be undertaken. This review examines some of the work undertaken to elucidate the whisker growth phenomenon. A brief history of whisker initiated failures along with key developments in whisker theory is presented. This is followed by a more detailed assessment of the several growth mechanisms hypothesised; dislocation-based, recrystallisation-based and compressive stress-based theories. The structure and properties of tin whiskers, along with factors that affect whisker growth and potential mitigation techniques are discussed.

    KW - Whisker growth

    KW - Zinc

    KW - Review

    KW - Electrodeposition

    U2 - 10.1179/0020296715Z.000000000227

    DO - 10.1179/0020296715Z.000000000227

    M3 - Review article

    VL - 93

    SP - 1

    EP - 8

    JO - Transactions of the IMF

    JF - Transactions of the IMF

    SN - 0020-2967

    IS - 2

    ER -