Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacture

Andrew J. Cobley, John E. Graves, Bilal Mkhlef, B.M. Abbas, Timothy J. Mason

    Research output: Chapter in Book/Report/Conference proceedingConference proceeding

    1 Citation (Scopus)
    113 Downloads (Pure)

    Abstract

    Electroless copper plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics industry. Electroless processes are characterised by high temperature operation and although the effect of ultrasound on electroless plating has been studied for many years, its use as an enabling technology to reduce the electroless plating operating temperature has not been investigated. In this study a catalysed electroless copper process was utilized and it was found that the use of low frequency ultrasound under optimised conditions can lead to a reduction in electroless copper plating temperature.
    Original languageEnglish
    Title of host publication2012 4th Electronic System-Integration Technology Conference
    PublisherIEEE
    ISBN (Electronic)978-146734645-0
    DOIs
    Publication statusPublished - 2012
    Event2012 4th Electronic System-Integration Technology Conference - Amsterdam, Netherlands
    Duration: 17 Sep 201220 Sep 2012

    Conference

    Conference2012 4th Electronic System-Integration Technology Conference
    CountryNetherlands
    CityAmsterdam
    Period17/09/1220/09/12

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    Bibliographical note

    This paper was given at the 4th Electronic System-Integration Technology Conference, ESTC 2012; Amsterdam; Netherlands; 17 September 2012 through 20 September 2012
    © Copyright 2014 IEEE

    Keywords

    • Copper plating
    • Electronics engineering
    • Electronics industry
    • High temperature operations
    • Ultrasonics
    • Electroless copper
    • Electroless copper plating
    • Electroless process
    • Enabling technologies
    • Low-frequency ultrasound
    • Nonconductive substrates
    • Operating temperature
    • Optimised conditions

    Cite this

    Cobley, A. J., Graves, J. E., Mkhlef, B., Abbas, B. M., & Mason, T. J. (2012). Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacture. In 2012 4th Electronic System-Integration Technology Conference [6542132] IEEE. https://doi.org/10.1109/ESTC.2012.6542132