Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacture

Andrew J. Cobley; John E. Graves; Bilal Mkhlef; B.M. Abbas; Timothy J. Mason

doi:10.1109/ESTC.2012.6542132

Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacture

Andrew J. Cobley, John E. Graves, Bilal Mkhlef, B.M. Abbas, Timothy J. Mason

Research output: Chapter in Book/Report/Conference proceeding › Conference proceeding › peer-review

2 Citations (Scopus)

164 Downloads (Pure)

Abstract

Electroless copper plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics industry. Electroless processes are characterised by high temperature operation and although the effect of ultrasound on electroless plating has been studied for many years, its use as an enabling technology to reduce the electroless plating operating temperature has not been investigated. In this study a catalysed electroless copper process was utilized and it was found that the use of low frequency ultrasound under optimised conditions can lead to a reduction in electroless copper plating temperature.

Original language	English
Title of host publication	2012 4th Electronic System-Integration Technology Conference
Publisher	IEEE
ISBN (Electronic)	978-146734645-0
DOIs	https://doi.org/10.1109/ESTC.2012.6542132
Publication status	Published - 2012
Event	2012 4th Electronic System-Integration Technology Conference - Amsterdam, Netherlands Duration: 17 Sept 2012 → 20 Sept 2012

Conference

Conference	2012 4th Electronic System-Integration Technology Conference
Country/Territory	Netherlands
City	Amsterdam
Period	17/09/12 → 20/09/12

Bibliographical note

This paper was given at the 4th Electronic System-Integration Technology Conference, ESTC 2012; Amsterdam; Netherlands; 17 September 2012 through 20 September 2012
© Copyright 2014 IEEE

Keywords

Copper plating
Electronics engineering
Electronics industry
High temperature operations
Ultrasonics
Electroless copper
Electroless copper plating
Electroless process
Enabling technologies
Low-frequency ultrasound
Nonconductive substrates
Operating temperature
Optimised conditions

Access to Document

10.1109/ESTC.2012.6542132

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Cite this

Cobley, AJ , Graves, JE, Mkhlef, B, Abbas, BM & Mason, TJ 2012, Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacture. in 2012 4th Electronic System-Integration Technology Conference., 6542132, IEEE, 2012 4th Electronic System-Integration Technology Conference, Amsterdam, Netherlands, 17/09/12. https://doi.org/10.1109/ESTC.2012.6542132

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title = "Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacture",

abstract = "Electroless copper plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics industry. Electroless processes are characterised by high temperature operation and although the effect of ultrasound on electroless plating has been studied for many years, its use as an enabling technology to reduce the electroless plating operating temperature has not been investigated. In this study a catalysed electroless copper process was utilized and it was found that the use of low frequency ultrasound under optimised conditions can lead to a reduction in electroless copper plating temperature. ",

keywords = "Copper plating, Electronics engineering, Electronics industry, High temperature operations, Ultrasonics, Electroless copper, Electroless copper plating, Electroless process, Enabling technologies, Low-frequency ultrasound, Nonconductive substrates, Operating temperature, Optimised conditions",

author = "Cobley, {Andrew J.} and Graves, {John E.} and Bilal Mkhlef and B.M. Abbas and Mason, {Timothy J.}",

note = "This paper was given at the 4th Electronic System-Integration Technology Conference, ESTC 2012; Amsterdam; Netherlands; 17 September 2012 through 20 September 2012 {\textcopyright} Copyright 2014 IEEE; 2012 4th Electronic System-Integration Technology Conference ; Conference date: 17-09-2012 Through 20-09-2012",

year = "2012",

doi = "10.1109/ESTC.2012.6542132",

language = "English",

booktitle = "2012 4th Electronic System-Integration Technology Conference",

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AU - Cobley, Andrew J.

AU - Graves, John E.

AU - Mkhlef, Bilal

AU - Abbas, B.M.

AU - Mason, Timothy J.

PY - 2012

Y1 - 2012

N2 - Electroless copper plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics industry. Electroless processes are characterised by high temperature operation and although the effect of ultrasound on electroless plating has been studied for many years, its use as an enabling technology to reduce the electroless plating operating temperature has not been investigated. In this study a catalysed electroless copper process was utilized and it was found that the use of low frequency ultrasound under optimised conditions can lead to a reduction in electroless copper plating temperature.

AB - Electroless copper plating is an important process for the metallization of non-conductive substrates and is therefore widely utilized throughout the electronics industry. Electroless processes are characterised by high temperature operation and although the effect of ultrasound on electroless plating has been studied for many years, its use as an enabling technology to reduce the electroless plating operating temperature has not been investigated. In this study a catalysed electroless copper process was utilized and it was found that the use of low frequency ultrasound under optimised conditions can lead to a reduction in electroless copper plating temperature.

KW - Copper plating

KW - Electronics engineering

KW - Electronics industry

KW - High temperature operations

KW - Ultrasonics

KW - Electroless copper

KW - Electroless copper plating

KW - Electroless process

KW - Enabling technologies

KW - Low-frequency ultrasound

KW - Nonconductive substrates

KW - Operating temperature

KW - Optimised conditions

U2 - 10.1109/ESTC.2012.6542132

DO - 10.1109/ESTC.2012.6542132

M3 - Conference proceeding

BT - 2012 4th Electronic System-Integration Technology Conference

PB - IEEE

T2 - 2012 4th Electronic System-Integration Technology Conference

Y2 - 17 September 2012 through 20 September 2012

ER -

Ultrasonically enabled low temperature electroless plating for sustainable electronic manufacture

Abstract

Conference

Bibliographical note

Keywords

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