The identation size effect and Hall-Petch behaviour of annealed polycrystalline copper

X.D. Hou, T.T. Zhu, N.M. Jennett, A.J. Bushby

Research output: Chapter in Book/Report/Conference proceedingConference proceeding

Abstract

Methods to obtain tensile stress-strain properties of materials from a practically non-destructive indentation test are of great industrial interest. Nano-Indentation is a good candidate; however, to do this successfully, indentation size effects must be accounted for.Many indentation size effects, such as strain gradient plasticity and micro-pillar experiments [1], show a size dependence proportional to the inverse square root of a length scale, in common with Hall-Petch behavior. Recently, however, the indentation size effect from small radius spherical indenters has been shown, for a range of fcc metals, not to follow a Hall-Petch-like relationship but to be proportional to the inverse cube root of indenter radius [2]. Here, we investigate these differences further and present results for the indentation size effect with spherical indenters on copper samples that have been engineered to have different grain sizes. The important experimental control parameter of the relative size of the indentation compared to the grain size is also explored since the cross over from grains significantly smaller than the contact radius to grains significantly larger than the contact radius occurs at different length scales in each sample. A thorough understanding of the various length-scale effects in the different test methods (e.g. the indentation size effect and grain size effect in indentation), is essential if a relationship, robust enough for industrial application, is to be defined to obtain tensile properties from an essentially non-destructive indentation test.
Original languageEnglish
Title of host publicationMaterials Research Society Symposium Proceedings
PublisherCurran Associates inc.
Pages61-66
Number of pages6
Volume976
ISBN (Print)9781604234244
DOIs
Publication statusPublished - 2006
EventMaterials Research Society Symposium - Boston, Massachusetts, United States
Duration: 27 Nov 20061 Dec 2006

Conference

ConferenceMaterials Research Society Symposium
CountryUnited States
CityBoston, Massachusetts
Period27/11/061/12/06

Fingerprint

indentation
copper
radii
grain size
scale effect
tensile properties
nanoindentation
tensile stress
plastic properties
gradients
metals

Cite this

Hou, X. D., Zhu, T. T., Jennett, N. M., & Bushby, A. J. (2006). The identation size effect and Hall-Petch behaviour of annealed polycrystalline copper. In Materials Research Society Symposium Proceedings (Vol. 976, pp. 61-66). Curran Associates inc.. https://doi.org/10.1557/PROC-976-0976-EE09-10

The identation size effect and Hall-Petch behaviour of annealed polycrystalline copper. / Hou, X.D.; Zhu, T.T.; Jennett, N.M.; Bushby, A.J.

Materials Research Society Symposium Proceedings. Vol. 976 Curran Associates inc., 2006. p. 61-66.

Research output: Chapter in Book/Report/Conference proceedingConference proceeding

Hou, XD, Zhu, TT, Jennett, NM & Bushby, AJ 2006, The identation size effect and Hall-Petch behaviour of annealed polycrystalline copper. in Materials Research Society Symposium Proceedings. vol. 976, Curran Associates inc., pp. 61-66, Materials Research Society Symposium, Boston, Massachusetts, United States, 27/11/06. https://doi.org/10.1557/PROC-976-0976-EE09-10
Hou XD, Zhu TT, Jennett NM, Bushby AJ. The identation size effect and Hall-Petch behaviour of annealed polycrystalline copper. In Materials Research Society Symposium Proceedings. Vol. 976. Curran Associates inc. 2006. p. 61-66 https://doi.org/10.1557/PROC-976-0976-EE09-10
Hou, X.D. ; Zhu, T.T. ; Jennett, N.M. ; Bushby, A.J. / The identation size effect and Hall-Petch behaviour of annealed polycrystalline copper. Materials Research Society Symposium Proceedings. Vol. 976 Curran Associates inc., 2006. pp. 61-66
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