Abstract
The electrodeposition of copper, gold, nickel, palladium and platinum onto Ebonex® ceramic cathodes has been studied. It is demonstrated that good quality deposits may be obtained and that the kinetics of the deposition and dissolution of metals are similar at Ebonex® to other common substrates (for example, Pt, C). In addition, the kinetics of some simple redox couples at coated and bare Ebonex® ceramic electrodes are compared; it is confirmed that such electron transfer reactions are very slow on the bare Ebonex® ceramic but when the surface is coated with a metal, the kinetics are similar to those on the bulk metal.
| Original language | English |
|---|---|
| Pages (from-to) | 848-857 |
| Number of pages | 10 |
| Journal | Journal of Applied Electrochemistry |
| Volume | 21 |
| Issue number | 10 |
| DOIs | |
| Publication status | Published - Oct 1991 |
| Externally published | Yes |
Keywords
- Copper
- Gold
- Nickel
- Platinum
ASJC Scopus subject areas
- General Chemical Engineering
- Materials Chemistry
- Electrochemistry