The effects of turmeric on the grain structure and properties of copper electrodeposited composites

Richard James Merrill, Liang Wu, John Graves, Jamie Beddow, Elena Fuentes, Andrew Cobley

Research output: Contribution to journalArticlepeer-review

Abstract

The objective of this research was to electrocodeposit turmeric particles into copper matrices, and assess the influence of turmeric on the microstructure and properties of those deposits. The incorporation of turmeric had a significant effect on both the grain structure and properties of the copper deposits, with turmeric particles of a Z-average size of 289 ± 30 and 278 ± 15 nm having a greater influence on grain refinement than particles of 134 ± 37 nm, even at much lower deposit particle contents. The incorporated turmeric increased both the hardness and water contact angle of the deposits; however, a reduction in resistance to salt spray corrosion was also observed.
Original languageEnglish
Pages (from-to)328-335
Number of pages8
JournalTransactions of the Institute of Materials Finishing
Volume98
Issue number6
Early online date11 Nov 2020
DOIs
Publication statusPublished - 2020

Keywords

  • Electrocodeposition
  • composite
  • copper
  • microstructure
  • sustainable
  • turmeric

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys

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