Abstract
This paper focuses on the causes that lead to the final destruction in standard gate-commutated thyristor (GCT) devices. A new 3-D model approach has been used for simulating the GCT which provides a deep insight into the operation of the GCT in extreme conditions. This allows drawing some conclusions on the complex mechanisms that drive these devices to destruction, previously impossible to explain using 2-D models.
Original language | English |
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Article number | 6410404 |
Pages (from-to) | 819-826 |
Number of pages | 8 |
Journal | Electron Devices |
Volume | 60 |
Issue number | 2 |
DOIs | |
Publication status | Published - 2013 |
Externally published | Yes |
Bibliographical note
© 2013 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.Keywords
- Full wafer modeling
- gate-commutated thyristor (GCT)
- maximum controllable current (MCC)
- safe operating area
- thyristor
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials