Abstract
An investigation of the structures and design parameters of 4H-SiC trench inversion-channel MOSFETs using a two-dimensional (2D) numerical device simulation is presented. Material parameters have been adjusted appropriately for the 4H-SiC polytype and a systematic characterisation and optimization of a specific trench MOSFET with a 1.2 kV blocking voltage capability has been performed. Simulations have concentrated on optimizing the p-type doping concentration at the trench bottom, to keep the breakdown electric field in the oxide under its critical value. The trench depth was also examined and optimized to give a better on-state performance. For the MOSFET structure examined, a minimized on-state resistance of 53 mΩ cm2 was obtained.
Original language | English |
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Pages (from-to) | 1081-1085 |
Number of pages | 5 |
Journal | Solid-State Electronics |
Volume | 49 |
Issue number | 7 |
DOIs | |
Publication status | Published - 1 Jul 2005 |
Externally published | Yes |
Keywords
- 4H-SiC
- Breakdown
- Electric field
- On-state resistance
- Trench MOSFET
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry