SPICE modeling of PT IGBT thermal behavior

N. Jankovic, P. Igic

    Research output: Chapter in Book/Report/Conference proceedingConference proceedingpeer-review

    1 Citation (Scopus)

    Abstract

    An electro-thermal model of Punch-Trough (PT) IGBT having a small set of temperature related fitting parameters was developed and implemented in SPICE. The model accuracy in predicting thermal behavior of such power device was validated by DC and transient measurements of a fabricated 200-A 850-V PT IGBT at 25°C, 75°C and 125°C.

    Original languageEnglish
    Title of host publication9th International Seminar on Power Semiconductors, ISPS 2008
    PublisherInstitution of Engineering and Technology
    Pages273-277
    Number of pages5
    Edition2
    ISBN (Print)9788001041390
    DOIs
    Publication statusPublished - 1 Dec 2008
    Event9th International Seminar on Power Semiconductors, ISPS 2008 - Prague, Czech Republic
    Duration: 27 Aug 200829 Aug 2008

    Publication series

    NameIET Seminar Digest
    Number2
    Volume2008

    Conference

    Conference9th International Seminar on Power Semiconductors, ISPS 2008
    Country/TerritoryCzech Republic
    CityPrague
    Period27/08/0829/08/08

    Keywords

    • Modelling
    • PT IGBT
    • SPICE
    • Thermal

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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