@inproceedings{74521306b6ea4bb2b4c35a8efaa3ffa6,
title = "SPICE modeling of PT IGBT thermal behavior",
abstract = "An electro-thermal model of Punch-Trough (PT) IGBT having a small set of temperature related fitting parameters was developed and implemented in SPICE. The model accuracy in predicting thermal behavior of such power device was validated by DC and transient measurements of a fabricated 200-A 850-V PT IGBT at 25°C, 75°C and 125°C.",
keywords = "Modelling, PT IGBT, SPICE, Thermal",
author = "N. Jankovic and P. Igic",
year = "2008",
month = dec,
day = "1",
doi = "10.1049/ic:20080205",
language = "English",
isbn = "9788001041390",
series = "IET Seminar Digest",
publisher = "Institution of Engineering and Technology",
number = "2",
pages = "273--277",
booktitle = "9th International Seminar on Power Semiconductors, ISPS 2008",
address = "United Kingdom",
edition = "2",
note = "9th International Seminar on Power Semiconductors, ISPS 2008 ; Conference date: 27-08-2008 Through 29-08-2008",
}