A soldering tip 10, for soldering apparatus (figure 5), may have titanium body portion 40; and a removable steel distal end 38 or outer steel coating (36, figure 3). Physical vapour deposition (PVD) or electrodeposition may be used to coat the body portion 40 with the outer steel coating (36, figure 3), possibly with an intermediate layer therebetween. The steel may have less than 2 wt% carbon and 5 wt% chromium; e.g. also comprising manganese, silicon, vanadium, phosphorus, sulphur, with the balance being iron. Silver steel may be used. The bit 10 may have a screw thread 28, for releasably attaching to the soldering apparatus (figure 5). Legs of an electrical component may be dipped into a bubble of molten solder, protruding from a through-bore 16 in the nozzle tip 10, before soldering the component to a printed circuit board (PCB) (figures 1 and 2).

Original languageEnglish
Patent numberGB2609595A
IPCB23K 101/42
Priority date25/05/22
Filing date25/05/21
Publication statusPublished - 15 Feb 2023


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