Abstract
Selective soldering utilizes a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby permits the process to be tailored to specific joints and permits multiple nozzle types to be used if required on the circuit board.
| Original language | English |
|---|---|
| Pages (from-to) | 46-48 |
| Number of pages | 3 |
| Journal | Printed Circuit Design and Fab/Circuits Assembly |
| Volume | 40 |
| Issue number | 5 |
| Publication status | Published - May 2023 |
Bibliographical note
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ASJC Scopus subject areas
- Industrial relations
- Industrial and Manufacturing Engineering
- Electrical and Electronic Engineering
- Management of Technology and Innovation
