Abstract
Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board.
| Original language | English |
|---|---|
| Volume | 15 |
| No. | 3 |
| Specialist publication | Journal of the Institute of Circuit Technology |
| Publication status | Published - 20 Oct 2022 |