Selective Soldering: A need for Innovation and Development

Research output: Contribution to specialist publicationArticle


Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board.
Original languageEnglish
Specialist publicationJournal of the Institute of Circuit Technology
Publication statusPublished - 20 Oct 2022


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