Selective Soldering:  A need for Innovation and Development

Sam J. McMaster; Andrew Cobley; John Graves; Nigel Monk

Selective Soldering: A need for Innovation and Development

Sam J. McMaster, Andrew Cobley, John Graves, Nigel Monk

Centre for Manufacturing and Materials

Pillarhouse International Ltd

Research output: Practice-Based and Non-textual Research › Web publication/site

Abstract

Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board.

Original language	English
Media of output	Online
Publication status	Published - 20 Oct 2022

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abstract = "Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board.",

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N2 - Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board.

AB - Selective soldering utilises a nozzle to apply solder to components on the underside of printed circuit boards (PCBs). This nozzle can be moved to either perform dips (depositing solder to a single component) or draws (applying solder to several components in a single movement). The selective soldering methodology thereby allows the process to be tailored to specific joints and allows multiple nozzle types to be used if required on the circuit board.

UR - https://instct.org/news/journals/ict-journal-vol-15-no-3#paper_2

M3 - Web publication/site

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Selective Soldering: A need for Innovation and Development

Abstract

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