Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic field

Sofya Danilova; John Graves; Andrew Cobley

doi:10.1016/j.matlet.2018.02.062

Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic field

Sofya Danilova, John Graves, Andrew Cobley

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4 Citations (Scopus)

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Abstract

The formation of printed circuit patterns on non-conductive substrates has many applications in high 7 value sectors such as the electronics sector. Current semi-additive and subtractive circuit 8 manufacturing processes use photolithography to pattern substrates coated with a thin or relatively 9 thick metal film. This process is often wasteful and expensive. Using an innovative approach; 10 composite Fe3O4-Ag nanoparticles were synthesized and attracted to a magnetic field. The 11 nanoparticles catalysed electroless copper deposition. Such a catalyst is new to electroless plating and 12 was deposited selectively on a dielectric substrate using a gradient magnetic field. In this way, 13 subsequent electroless copper plating occurred exclusively where the magnetic field was applied, 14 whilst the remaining surface was free of deposited metal. The advantage of this additive method of 15 manufacture is that less material is needed and less waste is produced.

Original language	English
Pages (from-to)	170-173
Number of pages	4
Journal	Materials Letters
Volume	219
Early online date	19 Feb 2018
DOIs	https://doi.org/10.1016/j.matlet.2018.02.062
Publication status	Published - 15 May 2018

Bibliographical note

NOTICE: this is the author’s version of a work that was accepted for publication in Materials Letters. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Materials Letters, 219, (2017)] DOI: 10.1016/j.matlet.2018.02.062

© 2017, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/

Keywords

Deposition
Electroless
Magnetic
Nanoparticles
Selective

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10.1016/j.matlet.2018.02.062

Post-PrintAccepted author manuscript, 840 KBLicence: CC BY-NC-ND

John Graves
- Centre for Manufacturing and Materials - Associate Professor Research
Person: Teaching and Research

Cite this

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title = "Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic field",

abstract = "The formation of printed circuit patterns on non-conductive substrates has many applications in high 7 value sectors such as the electronics sector. Current semi-additive and subtractive circuit 8 manufacturing processes use photolithography to pattern substrates coated with a thin or relatively 9 thick metal film. This process is often wasteful and expensive. Using an innovative approach; 10 composite Fe3O4-Ag nanoparticles were synthesized and attracted to a magnetic field. The 11 nanoparticles catalysed electroless copper deposition. Such a catalyst is new to electroless plating and 12 was deposited selectively on a dielectric substrate using a gradient magnetic field. In this way, 13 subsequent electroless copper plating occurred exclusively where the magnetic field was applied, 14 whilst the remaining surface was free of deposited metal. The advantage of this additive method of 15 manufacture is that less material is needed and less waste is produced.",

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AU - Danilova, Sofya

AU - Graves, John

AU - Cobley, Andrew

N1 - NOTICE: this is the author’s version of a work that was accepted for publication in Materials Letters. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Materials Letters, 219, (2017)] DOI: 10.1016/j.matlet.2018.02.062 © 2017, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/

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N2 - The formation of printed circuit patterns on non-conductive substrates has many applications in high 7 value sectors such as the electronics sector. Current semi-additive and subtractive circuit 8 manufacturing processes use photolithography to pattern substrates coated with a thin or relatively 9 thick metal film. This process is often wasteful and expensive. Using an innovative approach; 10 composite Fe3O4-Ag nanoparticles were synthesized and attracted to a magnetic field. The 11 nanoparticles catalysed electroless copper deposition. Such a catalyst is new to electroless plating and 12 was deposited selectively on a dielectric substrate using a gradient magnetic field. In this way, 13 subsequent electroless copper plating occurred exclusively where the magnetic field was applied, 14 whilst the remaining surface was free of deposited metal. The advantage of this additive method of 15 manufacture is that less material is needed and less waste is produced.

AB - The formation of printed circuit patterns on non-conductive substrates has many applications in high 7 value sectors such as the electronics sector. Current semi-additive and subtractive circuit 8 manufacturing processes use photolithography to pattern substrates coated with a thin or relatively 9 thick metal film. This process is often wasteful and expensive. Using an innovative approach; 10 composite Fe3O4-Ag nanoparticles were synthesized and attracted to a magnetic field. The 11 nanoparticles catalysed electroless copper deposition. Such a catalyst is new to electroless plating and 12 was deposited selectively on a dielectric substrate using a gradient magnetic field. In this way, 13 subsequent electroless copper plating occurred exclusively where the magnetic field was applied, 14 whilst the remaining surface was free of deposited metal. The advantage of this additive method of 15 manufacture is that less material is needed and less waste is produced.

KW - Deposition

KW - Electroless

KW - Magnetic

KW - Nanoparticles

KW - Selective

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DO - 10.1016/j.matlet.2018.02.062

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JO - Materials Letters

JF - Materials Letters

ER -

Selective electroless metallization of non-conductive substrates enabled by a Fe3O4/Ag catalyst and a gradient magnetic field

Abstract

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John Graves

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