TY - GEN
T1 - Polymer-polymer Bonding for Enhanced Functional Micro-Fluidic Chips Fabrication
AU - Sbeih, Suhad
AU - Albagdady, Ahmed
AU - Al-Halhouli, Ala'aldeen
PY - 2024/11/4
Y1 - 2024/11/4
N2 - The low-cost and convenient fabrication of polymer-based microfluidic devices is of great potential for many biomedical and environmental applications. Different microchannel designs are employed for various fluid mixing/separating techniques, such as valving, pumping, centrifugation, and filtration. Polymethyl methacrylate (PMMA) is highly attractive for fabricating disposable microfluidic devices because of its transparency, compatibility, robustness, and ease of fabrication. The challenging alignment of expensive, opaque pressure-sensitive adhesive (PSA) layers limits their use for bonding microchip components. Direct polymer-polymer bonding at the chip interface leads to perfectly bonded, transparent, and easily assembled microchips. In this study, microfluidic chips with different sizes of microchannel are fabricated. Six well-defined procedures were investigated for optimizing the polymer bonding between the chip parts. Different solvents, activation techniques (pressure, heat, light), and pre- cleaning
AB - The low-cost and convenient fabrication of polymer-based microfluidic devices is of great potential for many biomedical and environmental applications. Different microchannel designs are employed for various fluid mixing/separating techniques, such as valving, pumping, centrifugation, and filtration. Polymethyl methacrylate (PMMA) is highly attractive for fabricating disposable microfluidic devices because of its transparency, compatibility, robustness, and ease of fabrication. The challenging alignment of expensive, opaque pressure-sensitive adhesive (PSA) layers limits their use for bonding microchip components. Direct polymer-polymer bonding at the chip interface leads to perfectly bonded, transparent, and easily assembled microchips. In this study, microfluidic chips with different sizes of microchannel are fabricated. Six well-defined procedures were investigated for optimizing the polymer bonding between the chip parts. Different solvents, activation techniques (pressure, heat, light), and pre- cleaning
KW - Microfluidics
KW - Engraving
KW - Solvent
KW - Plasma Treatment
KW - Bonding
U2 - 10.1109/REM63063.2024.10735470
DO - 10.1109/REM63063.2024.10735470
M3 - Conference proceeding
SN - 979-8-3315-0598-1
SP - 387
EP - 392
BT - 2024 22nd International Conference on Research and Education in Mechatronics (REM)
PB - IEEE
T2 - 22nd International Conference on Research and Education in Mechatronics
Y2 - 24 September 2024 through 26 September 2024
ER -