Plating bath and method for depositing a metal layer on a substrate

Andrew J. Cobley; Mark J. Kapeckas; Erik Reddington; Wade Sonnenberg; Leon R. Barstad; Thomas Buckley

Plating bath and method for depositing a metal layer on a substrate

Andrew J. Cobley (Inventor), Mark J. Kapeckas (Inventor), Erik Reddington (Inventor), Wade Sonnenberg (Inventor), Leon R. Barstad (Inventor), Thomas Buckley (Inventor)

Research output: Patent

Abstract

A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

Original language	English
Patent number	JP2014037634A
IPC	C25D 3/02,C25D 3/04,C25D 3/12,C25D 3/22,C25D 3/26,C25D 3/34,C25D 3/38,C25D 3/48,C25D 3/50,C25D 3/56
Priority date	2/10/01
Filing date	18/10/13
Publication status	Published - 27 Feb 2014

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Cite this

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title = "Plating bath and method for depositing a metal layer on a substrate",

abstract = "A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.",

author = "Cobley, {Andrew J.} and Kapeckas, {Mark J.} and Erik Reddington and Wade Sonnenberg and Barstad, {Leon R.} and Thomas Buckley",

year = "2014",

month = feb,

day = "27",

language = "English",

type = "Patent",

note = "JP2014037634A; C25D 3/02,C25D 3/04,C25D 3/12,C25D 3/22,C25D 3/26,C25D 3/34,C25D 3/38,C25D 3/48,C25D 3/50,C25D 3/56",

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TY - PAT

T1 - Plating bath and method for depositing a metal layer on a substrate

AU - Cobley, Andrew J.

AU - Kapeckas, Mark J.

AU - Reddington, Erik

AU - Sonnenberg, Wade

AU - Barstad, Leon R.

AU - Buckley, Thomas

PY - 2014/2/27

Y1 - 2014/2/27

N2 - A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

AB - A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.

M3 - Patent

M1 - JP2014037634A

Y2 - 2013/10/18

ER -

Plating bath and method for depositing a metal layer on a substrate

Abstract

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