Plating bath and method for depositing a metal layer on a substrate

Andrew J. Cobley (Inventor), Mark J. Kapeckas (Inventor), Erik Reddington (Inventor), Wade Sonnenberg (Inventor), Leon R. Barstad (Inventor), Thomas Buckley (Inventor)

    Research output: Patent

    Abstract

    A metal plating bath and method of plating a metal on a substrate where the metal plating bath contains heteroatom organic compounds that prevent or inhibit the consumption of metal plating bath additives. The metal plating bath additives improve the brightness of plated metal as well as the ductility, micro-throwing power and macro-throwing power of the plating bath. The addition of the additive consumption inhibiting heteroatom organic compounds improves the physical properties of the plated metal as well as the efficiency of the plating process. The heteroatom organic compounds may contain sulfur, oxygen or nitrogen heteroatoms.
    Original languageEnglish
    Patent numberJP2014037634
    IPCH05K 3/ 24 A N
    Priority date2/10/01
    Publication statusPublished - 27 Feb 2014

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    Plating
    Metals
    Substrates
    Organic compounds
    Sulfur
    Macros
    Ductility
    Luminance
    Nitrogen
    Physical properties
    Oxygen

    Bibliographical note

    Full text available from the link given.

    Cite this

    Cobley, A. J., Kapeckas, M. J., Reddington, E., Sonnenberg, W., Barstad, L. R., & Buckley, T. (2014). IPC No. H05K 3/ 24 A N. Plating bath and method for depositing a metal layer on a substrate. (Patent No. JP2014037634).

    Plating bath and method for depositing a metal layer on a substrate. / Cobley, Andrew J. (Inventor); Kapeckas, Mark J. (Inventor); Reddington, Erik (Inventor); Sonnenberg, Wade (Inventor); Barstad, Leon R. (Inventor); Buckley, Thomas (Inventor).

    IPC No.: H05K 3/ 24 A N. Patent No.: JP2014037634.

    Research output: Patent

    Cobley, AJ, Kapeckas, MJ, Reddington, E, Sonnenberg, W, Barstad, LR & Buckley, T 2014, Plating bath and method for depositing a metal layer on a substrate, Patent No. JP2014037634, IPC No. H05K 3/ 24 A N.
    Cobley AJ, Kapeckas MJ, Reddington E, Sonnenberg W, Barstad LR, Buckley T, inventors. Plating bath and method for depositing a metal layer on a substrate. H05K 3/ 24 A N. 2014 Feb 27.
    Cobley, Andrew J. (Inventor) ; Kapeckas, Mark J. (Inventor) ; Reddington, Erik (Inventor) ; Sonnenberg, Wade (Inventor) ; Barstad, Leon R. (Inventor) ; Buckley, Thomas (Inventor). / Plating bath and method for depositing a metal layer on a substrate. IPC No.: H05K 3/ 24 A N. Patent No.: JP2014037634.
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    AU - Barstad, Leon R.

    AU - Buckley, Thomas

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