Stress-induced failure is investigated based on numerical modelling of the diffusional relaxation and groove growth in an aluminium line. A numerical model, based on surface and grain boundary diffusion, is improved and made to be very useful for time to failure estimation.
|Number of pages||7|
|Publication status||Published - 5 Jan 1999|
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry