Abstract
Stress-induced failure is investigated based on numerical modelling of the diffusional relaxation and groove growth in an aluminium line. A numerical model, based on surface and grain boundary diffusion, is improved and made to be very useful for time to failure estimation.
Original language | English |
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Pages (from-to) | 255-261 |
Number of pages | 7 |
Journal | Solid-State Electronics |
Volume | 43 |
Issue number | 2 |
DOIs | |
Publication status | Published - 5 Jan 1999 |
Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
- Electrical and Electronic Engineering
- Materials Chemistry