Novel Approach Toward Plasma Enhancement in Trench-Insulated Gate Bipolar Transistors

M. Antoniou, Neophytis Lophitis, F. Bauer, I. Nistor, M. Bellini, M. Rahimo, G. Amaratunga, F. Udrea

Research output: Contribution to journalArticle

17 Citations (Scopus)
42 Downloads (Pure)

Abstract

In this letter, a trench-insulated gate bipolar transistor (IGBT) design with local charge compensating layers featured at the cathode of the device is presented and analyzed. The superjunction or reduced surface effect proves to be very effective in overcoming the inherited ON-state versus breakdown tradeoff appearing in conventional devices, such as the soft punch through plus or field stop plus (FS+) IGBTs. This design enhances the ON-state performance of the FS+IGBT by increasing the plasma concentration at the cathode side without affecting either the switching performance or the breakdown rating.
Original languageEnglish
Pages (from-to)823-825
Number of pages3
JournalElectron device letters
Volume36
Issue number8
Early online date15 May 2015
DOIs
Publication statusPublished - Aug 2015

Bibliographical note

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Keywords

  • insulated gate bipolar transistors
  • plasma applications
  • power MOSFET
  • power bipolar transistors
  • semiconductor device breakdown
  • breakdown rating
  • cathode
  • local charge compensating layers
  • plasma enhancement
  • superjunction power MOSFET
  • trench-IGBT
  • trench-insulated gate bipolar transistors
  • Insulated Gate Bipolar Transistor (IGBT)
  • Insulated gate bipolar transistor (IGBT)
  • technology trade-off
  • Cathodes
  • Doping
  • Electric breakdown
  • Insulated gate bipolar transistors
  • Logic gates
  • Performance evaluation
  • Switches

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