Abstract
The effect of GaN cap and its thickness on device performance is investigated using simulations by Silvaco Atlas toolbox. The simulations are based on meticulous calibration of a conventional, lateral, GaN capped, 1μm gate-length HEMT with a source-to-gate and gate-to-drain spacings of 2μm, and 3μm, respectively. The breakdown voltage of the GaN HEMT is improved by the aid of p-doped GaN cap and field plates to BV=630V showing an improvement of 540V in comparison to an unoptimized device. Furthermore, the possible creation of two dimensional hole gas (2DHG) at the interface of GaN cap and AlGaN barrier and its effect on the device behaviour is studied.
Original language | English |
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Title of host publication | The Tenth International Conference on Advanced Semiconductor Devices and Microsystems |
Editors | Juraj Breza, Daniel Donoval, Erik Vavrinský |
Publisher | IEEE |
Pages | 1-4 |
Number of pages | 4 |
ISBN (Electronic) | 978-1-4799-5475-9 |
ISBN (Print) | 978-1-4799-5474-2 |
DOIs | |
Publication status | Published - 29 Dec 2014 |
Externally published | Yes |
Event | 10th International Conference on Advanced Semiconductor Devices and Microsystems - Smolenice, Slovakia Duration: 20 Oct 2014 → 22 Oct 2014 Conference number: 10th |
Conference
Conference | 10th International Conference on Advanced Semiconductor Devices and Microsystems |
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Abbreviated title | ASDAM 2014 |
Country/Territory | Slovakia |
City | Smolenice |
Period | 20/10/14 → 22/10/14 |
Keywords
- Gallium nitride
- HEMTs
- MODFETs
- Logic gates
- Aluminum gallium nitride
- Two dimensional hole gas ,
- Electric breakdown