Modeling of 2DEG and 2DHG in i-GaN capped AlGaN/AlN/GaN HEMTs

Research output: Chapter in Book/Report/Conference proceedingConference proceeding

4 Citations (Scopus)

Abstract

A 2D drift-diffusion model with Schrodinger-Poisson quantum corrections using ATLAS toolbox by Silvaco is calibrated against experimental I D -V GS characteristics of the 1 μm gate length GaN-based high electron mobility transistor (HEMT). The model takes into account both piezoelectric and spontaneous polarization effects at the all interfaces of GaN/Al 0.25 Ga 0.75 N/AlN/GaN structure. This unintentionally doped hetero-structure transistor has i) an enhanced carrier mobility due to the decrease in alloy-disorder and impurity scatterings; ii) an increased carrier sheet density in 2DEG due to a better confinement in the channel thanks to AlN spacer. These improvements considerably enhance the output power and performance of the GaN HEMTs. We found that surface traps play an essential role in the creation of 2DHG which can affect a carrier density in 2DEG.
Original languageEnglish
Title of host publication29th International Conference on Microelectronics Proceedings - MIEL 2014
PublisherIEEE
Pages81-84
Number of pages4
ISBN (Electronic)978-1-4799-5296-0
ISBN (Print)978-1-4799-5295-3
DOIs
Publication statusPublished - 26 Jun 2014
Externally publishedYes
Event2014 29th International Conference on Microelectronics Proceedings - Belgrade, Serbia
Duration: 12 May 201414 May 2014
Conference number: 29th

Conference

Conference2014 29th International Conference on Microelectronics Proceedings
Abbreviated titleMIEL 2014
CountrySerbia
CityBelgrade
Period12/05/1414/05/14

Keywords

  • Gallium nitride
  • HEMTs
  • MODFETs
  • Aluminum gallium nitride
  • III-V semiconductor materials
  • Two dimensional hole gas
  • Logic gates

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    Faramehr, S., Kalna, K., & Igic, P. (2014). Modeling of 2DEG and 2DHG in i-GaN capped AlGaN/AlN/GaN HEMTs. In 29th International Conference on Microelectronics Proceedings - MIEL 2014 (pp. 81-84). IEEE. https://doi.org/10.1109/MIEL.2014.6842090