Micromachining of invar with 784 beams using 1.3 ps laser source at 515 nm

Petr Hauschwitz; Bohumil Stoklasa; Jiří Kuchařík; Hana Turčičová; Michael Písařík; Jan Brajer; Danijela Rostohar; Tomáš Mocek; Martin Duda; Antonio Lucianetti

doi:10.3390/ma13132962

Micromachining of invar with 784 beams using 1.3 ps laser source at 515 nm

Petr Hauschwitz, Bohumil Stoklasa, Jiří Kuchařík, Hana Turčičová, Michael Písařík, Jan Brajer, Danijela Rostohar, Tomáš Mocek, Martin Duda, Antonio Lucianetti

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12 Citations (Scopus)

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Abstract

To fulfil the requirements for high-resolution organic light-emitting diode (OLED) displays, precise and high-quality micrometer-scale patterns have to be fabricated inside metal shadow masks. Invar has been selected for this application due to its unique properties, especially a low coefficient of thermal expansion. In this study, a novel cost-efficient method of multi-beam micromachining of invar will be introduced. The combination of a Meopta beam splitting, focusing and monitoring module with a galvanometer scanner and HiLASE high-energy pulse laser system emitting ultrashort pulses at 515 nm allows drilling and cutting of invar foil with 784 beams at once with high precision and almost no thermal effects and heat-affected zone, thus significantly improving the throughput and efficiency.

Original language	English
Article number	2962
Number of pages	9
Journal	Materials
Volume	13
Issue number	13
DOIs	https://doi.org/10.3390/ma13132962
Publication status	Published - 2 Jul 2020
Externally published	Yes

Bibliographical note

© 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).

Funder

This work is a result of project TN01000008 NCK CEPO-New methods for laser micromachining. This work was co-financed by the European Regional Development Fund and the state budget of the Czech Republic (project HiLASE CoE: Grant No. CZ.02.1.01/0.0/0.0/15_006/0000674) and from the European Union's Horizon 2020 research and innovation programme (Grant agreement NO 739573) and by the Ministry of Education, Youth and Sports of the Czech Republic (Programme NPU I Project No. LO1602).

Keywords

Multi-beam micromachining
Beam splitting
Invar
Shadow masks
OLED

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics

Access to Document

10.3390/ma13132962Licence: CC BY

PublishedFinal published version, 3.31 MBLicence: CC BY

Cite this

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title = "Micromachining of invar with 784 beams using 1.3 ps laser source at 515 nm",

abstract = "To fulfil the requirements for high-resolution organic light-emitting diode (OLED) displays, precise and high-quality micrometer-scale patterns have to be fabricated inside metal shadow masks. Invar has been selected for this application due to its unique properties, especially a low coefficient of thermal expansion. In this study, a novel cost-efficient method of multi-beam micromachining of invar will be introduced. The combination of a Meopta beam splitting, focusing and monitoring module with a galvanometer scanner and HiLASE high-energy pulse laser system emitting ultrashort pulses at 515 nm allows drilling and cutting of invar foil with 784 beams at once with high precision and almost no thermal effects and heat-affected zone, thus significantly improving the throughput and efficiency.",

keywords = "Multi-beam micromachining, Beam splitting, Invar, Shadow masks, OLED",

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AU - Hauschwitz, Petr

AU - Stoklasa, Bohumil

AU - Kuchařík, Jiří

AU - Turčičová, Hana

AU - Písařík, Michael

AU - Brajer, Jan

AU - Rostohar, Danijela

AU - Mocek, Tomáš

AU - Duda, Martin

AU - Lucianetti, Antonio

N1 - © 2020 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).

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N2 - To fulfil the requirements for high-resolution organic light-emitting diode (OLED) displays, precise and high-quality micrometer-scale patterns have to be fabricated inside metal shadow masks. Invar has been selected for this application due to its unique properties, especially a low coefficient of thermal expansion. In this study, a novel cost-efficient method of multi-beam micromachining of invar will be introduced. The combination of a Meopta beam splitting, focusing and monitoring module with a galvanometer scanner and HiLASE high-energy pulse laser system emitting ultrashort pulses at 515 nm allows drilling and cutting of invar foil with 784 beams at once with high precision and almost no thermal effects and heat-affected zone, thus significantly improving the throughput and efficiency.

AB - To fulfil the requirements for high-resolution organic light-emitting diode (OLED) displays, precise and high-quality micrometer-scale patterns have to be fabricated inside metal shadow masks. Invar has been selected for this application due to its unique properties, especially a low coefficient of thermal expansion. In this study, a novel cost-efficient method of multi-beam micromachining of invar will be introduced. The combination of a Meopta beam splitting, focusing and monitoring module with a galvanometer scanner and HiLASE high-energy pulse laser system emitting ultrashort pulses at 515 nm allows drilling and cutting of invar foil with 784 beams at once with high precision and almost no thermal effects and heat-affected zone, thus significantly improving the throughput and efficiency.

KW - Multi-beam micromachining

KW - Beam splitting

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KW - Shadow masks

KW - OLED

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Micromachining of invar with 784 beams using 1.3 ps laser source at 515 nm

Abstract

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Keywords

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Access to Document

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