Mechanical, Toughness and Thermal properties of 2D Material- Reinforced Epoxy Composites

Sensen Han; Qingshi Meng; Zhe  Qiu; Amr  Osman; Rui Cai; Yin  Yu; Tianqing  Liu; Sherif  Araby

doi:10.1016/j.polymer.2019.121884

Mechanical, Toughness and Thermal properties of 2D Material- Reinforced Epoxy Composites

Sensen Han, Qingshi Meng, Zhe Qiu, Amr Osman, Rui Cai, Yin Yu, Tianqing Liu, Sherif Araby

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Abstract

Developing epoxy composites with high thermal conductivity and excellent mechanical properties becomes imperative in electronic and aerospace industries. This study investigates and compares the effect of adding boron nitride (BN) sheets and graphene platelets (GnPs) on the mechanical properties and thermal conductivity of epoxy resin. The study shows that incorporation of BN or GnPs into epoxy matrix significantly enhanced both mechanical properties and thermal conductivity of epoxy composites. At fractions ranging 1−4 wt%, GnPs/epoxy composites provide higher Young's modulus, fracture toughness (K1c) and critical stress energy release rate (G1c) compared to BN/epoxy composites. The thermal conductivity of the epoxy composites is up to the maximum of 0.33 Wm-1K-1at 4 wt% of GnP loading, which is much higher than that of the composites filled with the same loading of BN (0.23 Wm-1K-1). The study emphasizes the importance of adding thin nanosheets (thickness 3-5 nm) at low loadings in developing epoxy composites to achieve desired mechanical and thermal properties.

Original language	English
Article number	121884
Journal	Polymer
Volume	184
Early online date	10 Oct 2019
DOIs	https://doi.org/10.1016/j.polymer.2019.121884
Publication status	Published - 5 Dec 2019

Bibliographical note

NOTICE: this is the author’s version of a work that was accepted for publication in Polymer. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Polymer, 184, (2019) DOI: 10.1016/j.polymer.2019.121884

© 2019, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/

Keywords

Graphene platelets;
Thermal conductivity
Mechanical strength;
Boron nitride;

Access to Document

10.1016/j.polymer.2019.121884

Post-PrintAccepted author manuscript, 1.43 MBLicence: CC BY-NC-ND

Cite this

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title = "Mechanical, Toughness and Thermal properties of 2D Material- Reinforced Epoxy Composites",

abstract = "Developing epoxy composites with high thermal conductivity and excellent mechanical properties becomes imperative in electronic and aerospace industries. This study investigates and compares the effect of adding boron nitride (BN) sheets and graphene platelets (GnPs) on the mechanical properties and thermal conductivity of epoxy resin. The study shows that incorporation of BN or GnPs into epoxy matrix significantly enhanced both mechanical properties and thermal conductivity of epoxy composites. At fractions ranging 1−4 wt%, GnPs/epoxy composites provide higher Young's modulus, fracture toughness (K1c) and critical stress energy release rate (G1c) compared to BN/epoxy composites. The thermal conductivity of the epoxy composites is up to the maximum of 0.33 Wm-1K-1at 4 wt% of GnP loading, which is much higher than that of the composites filled with the same loading of BN (0.23 Wm-1K-1). The study emphasizes the importance of adding thin nanosheets (thickness 3-5 nm) at low loadings in developing epoxy composites to achieve desired mechanical and thermal properties.",

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author = "Sensen Han and Qingshi Meng and Zhe Qiu and Amr Osman and Rui Cai and Yin Yu and Tianqing Liu and Sherif Araby",

note = "NOTICE: this is the author{\textquoteright}s version of a work that was accepted for publication in Polymer. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Polymer, 184, (2019) DOI: 10.1016/j.polymer.2019.121884 {\textcopyright} 2019, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/ ",

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AU - Han, Sensen

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AU - Osman, Amr

AU - Cai, Rui

AU - Yu, Yin

AU - Liu, Tianqing

AU - Araby, Sherif

N1 - NOTICE: this is the author’s version of a work that was accepted for publication in Polymer. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Polymer, 184, (2019) DOI: 10.1016/j.polymer.2019.121884 © 2019, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/

PY - 2019/12/5

Y1 - 2019/12/5

N2 - Developing epoxy composites with high thermal conductivity and excellent mechanical properties becomes imperative in electronic and aerospace industries. This study investigates and compares the effect of adding boron nitride (BN) sheets and graphene platelets (GnPs) on the mechanical properties and thermal conductivity of epoxy resin. The study shows that incorporation of BN or GnPs into epoxy matrix significantly enhanced both mechanical properties and thermal conductivity of epoxy composites. At fractions ranging 1−4 wt%, GnPs/epoxy composites provide higher Young's modulus, fracture toughness (K1c) and critical stress energy release rate (G1c) compared to BN/epoxy composites. The thermal conductivity of the epoxy composites is up to the maximum of 0.33 Wm-1K-1at 4 wt% of GnP loading, which is much higher than that of the composites filled with the same loading of BN (0.23 Wm-1K-1). The study emphasizes the importance of adding thin nanosheets (thickness 3-5 nm) at low loadings in developing epoxy composites to achieve desired mechanical and thermal properties.

AB - Developing epoxy composites with high thermal conductivity and excellent mechanical properties becomes imperative in electronic and aerospace industries. This study investigates and compares the effect of adding boron nitride (BN) sheets and graphene platelets (GnPs) on the mechanical properties and thermal conductivity of epoxy resin. The study shows that incorporation of BN or GnPs into epoxy matrix significantly enhanced both mechanical properties and thermal conductivity of epoxy composites. At fractions ranging 1−4 wt%, GnPs/epoxy composites provide higher Young's modulus, fracture toughness (K1c) and critical stress energy release rate (G1c) compared to BN/epoxy composites. The thermal conductivity of the epoxy composites is up to the maximum of 0.33 Wm-1K-1at 4 wt% of GnP loading, which is much higher than that of the composites filled with the same loading of BN (0.23 Wm-1K-1). The study emphasizes the importance of adding thin nanosheets (thickness 3-5 nm) at low loadings in developing epoxy composites to achieve desired mechanical and thermal properties.

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KW - Thermal conductivity

KW - Mechanical strength;

KW - Boron nitride;

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M1 - 121884

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Mechanical, Toughness and Thermal properties of 2D Material- Reinforced Epoxy Composites

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Rui Cai

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Mechanical, Toughness and Thermal properties of 2D Material- Reinforced Epoxy Composites

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Bibliographical note

Keywords

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Rui Cai

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