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Measurement and Modelling of Residual Stress in Wire-Feed Additively Manufactured Titanium

  • Bilal Ahmed
  • , Sjoerd van der Veen
  • , Michael Fitzpatrick
  • , Hua Guo
    • AIRBUS

    Research output: Contribution to journal › Article › peer-review

    258 Downloads (Pure)

    Abstract

    Residual stresses were characterised in a wire-feed additively manufactured titanium alloy component. A numerical simulation based on the inherent strain method was used to model residual stresses arising from the manufacturing process. The contour method was used to experimentally determine the residual stress field. High tensile residual stresses were seen at and around the interface of the substrate and the deposited metal. Compressive residual stresses were present in the substrate and at the top of the deposit. The satisfactory correlation was achieved between the results from the numerical simulation and the contour method, except for the location of the root of the deposit. The effect of pre-heating the sample substrate on the residual stress distribution is also discussed.
    Original languageEnglish
    Pages (from-to)2250-2259
    Number of pages10
    JournalMaterials Science and Technology
    Volume34
    Issue number18
    Early online date3 Oct 2018
    DOIs
    Publication statusPublished - 2018

    Bibliographical note

    This is an Accepted Manuscript of an article published by Taylor & Francis in Materials Science and Technology on 03 October 2018], available online: http://www.tandfonline.com/10.1080/02670836.2018.1528747

    Copyright © and Moral Rights are retained by the author(s) and/ or other copyright owners. A copy can be downloaded for personal non-commercial research or study, without prior permission or charge. This item cannot be reproduced or quoted extensively from without first obtaining permission in writing from the copyright holder(s). The content must not be changed in any way or sold commercially in any format or medium without the formal permission of the copyright holders.

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