Low-frequency ‘delay time’ ultrasound and its effect on electroless Cu metallisation of a Pd activated dielectric material

The effect that the presence of low-frequency ultrasound has on the deposition rate of an electroless Cu plating process for the metallisation of a Pd activated dielectric material has been preliminarily studied. Continuous ultrasound during electroless Cu plating had little effect on the deposition rate compared with the standard process under mechanical agitation due to the detrimental effect of cavitation on removing Pd from the dielectric materials. However, the introduction of a ‘delay time’ prior to the introduction of ultrasound resulted in an increase of the deposition rate of up to 26% (7-min delay time) and suggested that low frequency ultrasound could enable a reduction in electroless copper operating temperatures without a significant decrease in plating rate. Cu coatings produced in such conditions exhibited a significantly enhanced surface coverage with reduced porosity without any undesired effect on the crystal structure.Publisher statement:

NOTICE: this is the author’s version of a work that was accepted for publication in Thin Solid Films. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Thin Solid Films, [597, (2015)]DOI: 10.1016/j.tsf.2015.11.068

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