Abstract
Lead is restricted in solder joints because of environmental legislations. In this study, a new ternary solder alloy Sn-0.5Cu-3.5Bi is proposed. Alloys prepared using induction furnace have been analysed for their material properties. Melting temperature lies in the range of 219.5-220.5 °C. Hardness value lies in the range of 20.5-20.8 Hv. Good wetting property have also been obtained. Grain boundaries were attained from the microstructure evaluation. A comparison with SAC305 and SAC405 also shows that the new alloy is having better properties. Sn-0.5Cu-3.5Bi is a new lead free solder alloy for electronic packages subjected to moderately high temperature surroundings.
| Original language | English |
|---|---|
| Pages (from-to) | 329-331 |
| Number of pages | 3 |
| Journal | Materials Today: Proceedings |
| Volume | 21 |
| Early online date | 8 Jul 2019 |
| DOIs | |
| Publication status | Published - 5 Feb 2020 |
| Externally published | Yes |
| Event | 2019 International Conference on Recent Trends in Nanomaterials for Energy, Environmental and Engineering Applications, ICONEEEA 2019 - Tiruchirappalli, India Duration: 14 Mar 2019 → 15 Mar 2019 |
Bibliographical note
Publisher Copyright:© 2019 Elsevier Ltd. All rights reserved.
Keywords
- Lead-free
- Solder alloy
- Wettability
- Microstructure
- Melting temperature
- Hardness
ASJC Scopus subject areas
- General Materials Science