Investigations on the properties of new lead free solder alloy composition – Sn-0.5Cu-3.5Bi

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7 Citations (Scopus)

Abstract

Lead is restricted in solder joints because of environmental legislations. In this study, a new ternary solder alloy Sn-0.5Cu-3.5Bi is proposed. Alloys prepared using induction furnace have been analysed for their material properties. Melting temperature lies in the range of 219.5-220.5 °C. Hardness value lies in the range of 20.5-20.8 Hv. Good wetting property have also been obtained. Grain boundaries were attained from the microstructure evaluation. A comparison with SAC305 and SAC405 also shows that the new alloy is having better properties. Sn-0.5Cu-3.5Bi is a new lead free solder alloy for electronic packages subjected to moderately high temperature surroundings.

Original languageEnglish
Pages (from-to)329-331
Number of pages3
JournalMaterials Today: Proceedings
Volume21
Early online date8 Jul 2019
DOIs
Publication statusPublished - 5 Feb 2020
Externally publishedYes
Event2019 International Conference on Recent Trends in Nanomaterials for Energy, Environmental and Engineering Applications, ICONEEEA 2019 - Tiruchirappalli, India
Duration: 14 Mar 201915 Mar 2019

Bibliographical note

Publisher Copyright:
© 2019 Elsevier Ltd. All rights reserved.

Keywords

  • Lead-free
  • Solder alloy
  • Wettability
  • Microstructure
  • Melting temperature
  • Hardness

ASJC Scopus subject areas

  • Materials Science(all)

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