@inproceedings{8898542706854fcc8576a08ccc91d927,
title = "Investigation of the thermal stress field in a multilevel aluminium metallization in VLSI systems using finite element modelling approach",
abstract = "The impact of a titanium barrier layer on the residual thermal stress in passivated multilevel aluminium metallization structure (Al lines and connecting via) is investigated using an advanced finite element approach. It is confirmed that the titanium, when is presented in the structure, can significantly improve the reliability of the Al metallization.",
author = "Igic, {P. M.} and Mawby, {P. A.}",
year = "2000",
month = aug,
day = "6",
doi = "10.1109/ICMEL.2000.840586",
language = "English",
isbn = "0780352351",
series = "2000 22nd International Conference on Microelectronics, MIEL 2000 - Proceedings",
publisher = "IEEE Computer Society",
pages = "347--350",
booktitle = "2000 22nd International Conference on Microelectronics, MIEL 2000 - Proceedings",
address = "United States",
note = "2000 22nd International Conference on Microelectronics, MIEL 2000 ; Conference date: 14-05-2000 Through 17-05-2000",
}