Investigation into the effects of magnetic agitation and pulsed current on the development of Sn Cu alloy electrodeposits

Research output: Contribution to journalArticle

Abstract

SnCu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of SnCu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of SnCu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the SnCu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the SnCu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.

Original languageEnglish
Pages (from-to)118-127
Number of pages10
JournalThin Solid Films
Volume683
Early online date20 May 2019
DOIs
Publication statusPublished - 1 Aug 2019

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agitation
Current density
industries
current density
aerospace industry
Aerospace industry
Electronics industry
electroplating
Electroplating
Automotive industry
Electrodeposition
electrodeposition
Electrolytes
Surface morphology
surface roughness
chemical composition
Cathodes
cathodes
Surface roughness
electrolytes

Cite this

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title = "Investigation into the effects of magnetic agitation and pulsed current on the development of Sn Cu alloy electrodeposits",
abstract = "SnCu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of SnCu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of SnCu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the SnCu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the SnCu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.",
author = "Liang Wu and Andrew Cobley",
year = "2019",
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day = "1",
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language = "English",
volume = "683",
pages = "118--127",
journal = "Thin Solid Films",
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T1 - Investigation into the effects of magnetic agitation and pulsed current on the development of Sn Cu alloy electrodeposits

AU - Wu, Liang

AU - Cobley, Andrew

PY - 2019/8/1

Y1 - 2019/8/1

N2 - SnCu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of SnCu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of SnCu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the SnCu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the SnCu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.

AB - SnCu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of SnCu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of SnCu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the SnCu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the SnCu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.

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DO - 10.1016/j.tsf.2019.05.041

M3 - Article

VL - 683

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JO - Thin Solid Films

JF - Thin Solid Films

SN - 0040-6090

ER -