Investigation into the effects of magnetic agitation and pulsed current on the development of Sn Cu alloy electrodeposits

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    Abstract

    SnCu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of SnCu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of SnCu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the SnCu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the SnCu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.

    Original languageEnglish
    Pages (from-to)118-127
    Number of pages10
    JournalThin Solid Films
    Volume683
    Early online date20 May 2019
    DOIs
    Publication statusPublished - 1 Aug 2019

    Bibliographical note

    NOTICE: this is the author’s version of a work that was accepted for publication in Thin Solid Films. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Thin Solid Films, 683, (2019) DOI: 10.1016/j.tsf.2019.05.041

    © 2017, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/10.1016/j.tsf.2019.05.041

    Keywords

    • Tin-copper alloy
    • Electrodeposition
    • Thin films
    • Pulsed current
    • Tin whiskers

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