Investigation into the effects of magnetic agitation and pulsed current on the development of Sn Cu alloy electrodeposits

Liang Wu; Andrew Cobley

doi:10.1016/j.tsf.2019.05.041

Investigation into the effects of magnetic agitation and pulsed current on the development of Sn Cu alloy electrodeposits

Liang Wu, Andrew Cobley

Research output: Contribution to journal › Article › peer-review

9 Citations (Scopus)

77 Downloads (Pure)

Abstract

SnCu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of SnCu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of SnCu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the SnCu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the SnCu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.

Original language	English
Pages (from-to)	118-127
Number of pages	10
Journal	Thin Solid Films
Volume	683
Early online date	20 May 2019
DOIs	https://doi.org/10.1016/j.tsf.2019.05.041
Publication status	Published - 1 Aug 2019

Bibliographical note

NOTICE: this is the author’s version of a work that was accepted for publication in Thin Solid Films. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Thin Solid Films, 683, (2019) DOI: 10.1016/j.tsf.2019.05.041

© 2017, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/10.1016/j.tsf.2019.05.041

Keywords

Tin-copper alloy
Electrodeposition
Thin films
Pulsed current
Tin whiskers

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10.1016/j.tsf.2019.05.041

Post-PrintAccepted author manuscript, 3.06 MBLicence: CC BY-NC-ND

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title = "Investigation into the effects of magnetic agitation and pulsed current on the development of Sn Cu alloy electrodeposits",

abstract = "SnCu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of SnCu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of SnCu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the SnCu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the SnCu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.",

keywords = "Tin-copper alloy, Electrodeposition, Thin films, Pulsed current, Tin whiskers",

author = "Liang Wu and Andrew Cobley",

note = "NOTICE: this is the author{\textquoteright}s version of a work that was accepted for publication in Thin Solid Films. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Thin Solid Films, 683, (2019) DOI: 10.1016/j.tsf.2019.05.041 {\textcopyright} 2017, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/10.1016/j.tsf.2019.05.041 ",

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doi = "10.1016/j.tsf.2019.05.041",

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TY - JOUR

T1 - Investigation into the effects of magnetic agitation and pulsed current on the development of Sn Cu alloy electrodeposits

AU - Wu, Liang

AU - Cobley, Andrew

N1 - NOTICE: this is the author’s version of a work that was accepted for publication in Thin Solid Films. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reflected in this document. Changes may have been made to this work since it was submitted for publication. A definitive version was subsequently published in Thin Solid Films, 683, (2019) DOI: 10.1016/j.tsf.2019.05.041 © 2017, Elsevier. Licensed under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International http://creativecommons.org/licenses/by-nc-nd/4.0/10.1016/j.tsf.2019.05.041

PY - 2019/8/1

Y1 - 2019/8/1

N2 - SnCu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of SnCu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of SnCu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the SnCu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the SnCu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.

AB - SnCu alloy electrodeposits have found a wide range of applications in the electronics, automotive and aerospace industries. In the current research, the electrodeposition of SnCu alloy coatings produced from an electrolyte based on fluoroboric acids was thoroughly studied. The cathode current density was found to have a significant impact on the appearance and the surface morphology of SnCu alloy electrodeposits. Our experimental results suggested that deposition current density, magnetic agitation and pulsed current parameters (pulse frequency and duty cycle) were all found to be crucial factors significantly affecting the chemical composition of the SnCu alloy electrodeposits. In addition, the employment of pulsed current techniques significantly improved the edge effect and the surface roughness. Whisker growth on the SnCu alloy electrodeposits was assessed. All the samples subjected to different electroplating condition were prone to develop Sn whiskers after a few weeks of storage at room temperature.

KW - Tin-copper alloy

KW - Electrodeposition

KW - Thin films

KW - Pulsed current

KW - Tin whiskers

U2 - 10.1016/j.tsf.2019.05.041

DO - 10.1016/j.tsf.2019.05.041

M3 - Article

SN - 0040-6090

VL - 683

SP - 118

EP - 127

JO - Thin Solid Films

JF - Thin Solid Films

ER -

Investigation into the effects of magnetic agitation and pulsed current on the development of Sn Cu alloy electrodeposits

Abstract

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Keywords

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