Improvements of metal additive manufactured AISI 304L and Ti6Al4V parts by using laser shock peening as a post-process technique

Sanin Zulić, Michael Fitzmire, Ebrahim Asadi, Danijela Rostohar, Sunil Pathak, Jan Brajer, Jan Kaufman, Marek Boehm, Ondrej Stransky

Research output: Chapter in Book/Report/Conference proceedingConference proceedingpeer-review

4 Citations (Scopus)

Abstract

Metal Additive Manufacturing has been recognized as a technology of the future providing numerous benefits such as the production of complex shape and lightweight parts, easy customization, design freedom, etc. However, there are many areas where metal additive manufacturing cannot be applied since the quality of produced parts still does not satisfy the requirements of high-demanding industries for the production of their critical parts. Recently, Laser Shock Peening (LSP) has been investigated as a post-processing technique in metal additive manufacturing, primarily for the improvement of fatigue behavior. Here we will present improvements in fatigue life, the analysis of microstructure, and all the benefits LSP can bring to Metal Additive Manufacturing, for two types of material; stainless steel AISI 304L and titanium alloy Ti6Al4V.

Original languageEnglish
Title of host publicationProceedings Laser 3D Manufacturing IX 2022
EditorsBo Gu, Hongqiang Chen, Henry Helvajian
PublisherSPIE
ISBN (Electronic)9781510648555
DOIs
Publication statusPublished - 4 Mar 2022
Externally publishedYes
EventLaser 3D Manufacturing IX 2022 - Virtual, Online
Duration: 20 Jan 202224 Jan 2022

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
Volume11992
ISSN (Print)0277-786X
ISSN (Electronic)1996-756X

Conference

ConferenceLaser 3D Manufacturing IX 2022
CityVirtual, Online
Period20/01/2224/01/22

Bibliographical note

Publisher Copyright:
© 2022 SPIE.

Keywords

  • AISI 304L
  • Laser Shock Peening
  • Metal Additive Manufacturing
  • Post-processing
  • Ti6Al4V

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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