Improved electroless copper compositions

A POOLE, MARK (Inventor), J COBLEY, ANDREW (Inventor), AMRIK SINGH, (Inventor), V HIRST, DEBORAH (Inventor)

    Research output: Patent

    Abstract

    Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

    Original languageEnglish
    Patent numberTW200813254A
    IPCH05K 3/18 ,C23C 18/40
    Priority date7/07/06
    Filing date5/07/07
    Publication statusPublished - 16 Mar 2008

    Access to Document

    Fingerprint

    Dive into the research topics of 'Improved electroless copper compositions'. Together they form a unique fingerprint.
    View full fingerprint

    • Electroless copper compositions

      POOLE MARK, A. (Inventor), COBLEY ANDREW, J. (Inventor), SINGH, A. (Inventor) & HIRST DEBORAH, V. (Inventor), 14 Feb 2008, IPC No. C09D 5/00 , H05K 3/00, Patent No. US2008038452A1, 6 Jul 2007, Priority date 6 Jul 2007, Priority No. US20070825379

      Research output: Patent

      Open Access

    • Formaldehyde free electroless copper compositions

      POOLE, MARK, A. (Inventor), COBLEY, ANDREW, J. (Inventor), SINGH, A. (Inventor) & HIRST, DEBORAH, V. (Inventor), 16 Feb 2008, IPC No. H05K 3/42 , C23C 18/38, Patent No. TW200809004A, 2 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819249P

      Research output: Patent

      Open Access

    • Improved Electroless Copper Composition

      POOLE MARK, A. (Inventor), COBLEY ANDREW, J. (Inventor), SINGH, A. (Inventor) & HIRST DEBORAH, V. (Inventor), 29 May 2008, IPC No. H05K 3/42, C23C 18/40, H05K3/18, Patent No. JP2008121106A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819247P

      Research output: Patent

      Open Access

    Cite this