Improved electroless copper compositions

A POOLE, MARK (Inventor), J COBLEY, ANDREW (Inventor), AMRIK SINGH, (Inventor), V HIRST, DEBORAH (Inventor)

Research output: Patent

Abstract

Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

Original languageEnglish
Patent numberTW200813254A
IPCH05K 3/18 ,C23C 18/40
Priority date7/07/06
Filing date5/07/07
Publication statusPublished - 16 Mar 2008

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  • Electroless copper compositions

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 14 Feb 2008, IPC No. C09D 5/00 , H05K 3/00, Patent No. US2008038452A1, 6 Jul 2007, Priority date 6 Jul 2007, Priority No. US20070825379

    Research output: Patent

    Open Access

  • Formaldehyde free electroless copper compositions

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Feb 2008, IPC No. H05K 3/42 , C23C 18/38, Patent No. TW200809004A, 2 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819249P

    Research output: Patent

    Open Access

  • Improved Electroless Copper Composition

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 29 May 2008, IPC No. H05K 3/42, C23C 18/40, H05K3/18, Patent No. JP2008121106A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819247P

    Research output: Patent

    Open Access

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