Improved electroless copper compositions

A POOLE, MARK (Inventor), J COBLEY, ANDREW (Inventor), AMRIK SINGH, (Inventor), V HIRST, DEBORAH (Inventor)

Research output: Patent

Abstract

Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

Original languageEnglish
Patent numberTW200813254
IPCH05K 3/ 18 A I
Priority date7/07/06
Publication statusPublished - 16 Mar 2008

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    • Research Output

    Electroless copper compositions

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 14 Feb 2008, IPC No. C09D 5/ 00 A I, Patent No. US2008038452, Priority date 6 Jul 2007, Priority No. US20070825379

    Research output: Patent

    Open Access

    • IMPROVED ELECTROLESS COPPER COMPOSITION

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 29 May 2008, IPC No. H05K 3/ 42 A I, Patent No. JP2008121106, Priority date 7 Jul 2006, Priority No. US20060819247P

    Research output: Patent

    Open Access

    • Cite this

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK., & HIRST, DEBORAH, V. (2008). IPC No. H05K 3/ 18 A I. Improved electroless copper compositions. (Patent No. TW200813254).