IMPROVED ELECTROLESS COPPER COMPOSITION

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

Research output: Patent

Abstract

PROBLEM TO BE SOLVED: To provide an electroless copper plating composition which is free from formaldehyde harmful as a reducing agent and is environmentally friendly, and also provides uniform copper deposits. SOLUTION: The electroless copper plating composition comprises: one or more sources of copper ions; one or more chelating agents chosen from hydantoin and hydantoin derivatives; and one or more reducing agents chosen from fructose and fructose esters. Also, disclosed is an electroless copper plating method for a printed circuit board including a plurality of through-holes using the copper electroless plating composition. ;COPYRIGHT: (C)2008,JPO&INPIT

Original languageEnglish
Patent numberJP2008121106
IPCH05K 3/ 42 A I
Priority date7/07/06
Publication statusPublished - 29 May 2008

Bibliographical note

This patent has also been published as CN101104928 (A), EP1876260 (A2), EP1876260 (A3), JP5317438 (B2), KR101429939 (B1), KR20080005127 (A), TW200813254 (A), TWI347982 (B), US2008038452 (A1), KR20080005127

Fingerprint Dive into the research topics of 'IMPROVED ELECTROLESS COPPER COMPOSITION'. Together they form a unique fingerprint.

  • Research Output

    Improved electroless copper compositions

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/ 18 A I, Patent No. TW200813254, Priority date 7 Jul 2006, Priority No. US20060819247P

    Research output: Patent

    Open Access
  • Cite this

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK., & HIRST DEBORAH, V. (2008). IPC No. H05K 3/ 42 A I. IMPROVED ELECTROLESS COPPER COMPOSITION. (Patent No. JP2008121106).