Improved Electroless Copper Composition

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

Research output: Patent

Abstract

PROBLEM TO BE SOLVED: To provide an electroless copper plating composition which is free from formaldehyde harmful as a reducing agent and is environmentally friendly, and also provides uniform copper deposits. SOLUTION: The electroless copper plating composition comprises: one or more sources of copper ions; one or more chelating agents chosen from hydantoin and hydantoin derivatives; and one or more reducing agents chosen from fructose and fructose esters. Also, disclosed is an electroless copper plating method for a printed circuit board including a plurality of through-holes using the copper electroless plating composition. ;COPYRIGHT: (C)2008,JPO&INPIT

Original languageEnglish
Patent numberJP2008121106A
IPCH05K 3/42,C23C 18/40,H05K3/18
Priority date7/07/06
Filing date6/07/07
Publication statusPublished - 29 May 2008

Bibliographical note

This patent has also been published as CN101104928 (A), EP1876260 (A2), EP1876260 (A3), JP5317438 (B2), KR101429939 (B1), KR20080005127 (A), TW200813254 (A), TWI347982 (B), US2008038452 (A1), KR20080005127

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  • Improved electroless copper compositions

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/18 , C23C 18/40, Patent No. TW200813254A, 5 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819247P

    Research output: Patent

    Open Access

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