High performance thin heat pipe: Recent advances in device designs and their applications in sustainable energy systems

Yongjia  Wu; Dongyong Liu; Sitong  Zhao; Donghao  Zhao; Congcong  Zhi; Yaoyu  Pan; Yueping Fang; Nan  Zhou; Tingzhen Ming

doi:10.1016/j.applthermaleng.2024.125116

High performance thin heat pipe: Recent advances in device designs and their applications in sustainable energy systems

Yongjia Wu, Dongyong Liu, Sitong Zhao, Donghao Zhao, Congcong Zhi, Yaoyu Pan, Yueping Fang, Nan Zhou, Tingzhen Ming

School of Energy, Construction and Environment

Research output: Contribution to journal › Article › peer-review

3 Citations (Scopus)

Abstract

Due to the limited surface area for heat dissipation, the increasing heat flux generated by modern electronics has become a significant challenge for engineering applications. Heat pipes (HPs) have been widely utilized in various scenarios for heat dissipation, owing to their high heat transfer performance, good stability, and long lifespan. The demand for developing thinner HPs has led to the exploration of novel techniques. This paper provides a comprehensive overview of strategies to improve the heat transfer performance of thin heat pipes (THPs), covering aspects such as HP types, materials, wick structures, and advanced manufacturing technologies. The characteristics of each wick structure are detailed and classified according to their spatial morphology. Additionally, the requirements for THPs vary across different application scenarios. The paper discusses the design and fabrication methods of THPs, focusing on ultra-thin HPs in smartphones and large-size THPs for engineering applications. The applicat

Original language	English
Article number	125116
Number of pages	29
Journal	Applied Thermal Engineering
Volume	261
Early online date	30 Nov 2024
DOIs	https://doi.org/10.1016/j.applthermaleng.2024.125116
Publication status	Published - 15 Feb 2025

Bibliographical note

Publisher Copyright:
© 2024 Elsevier Ltd

Funding

This research was supported by the National Natural Science Foundation of China (Grant No. 52208124, and Grant No.52278123), Hubei Provincial Key Research and Design Project (Grant No. 2020BAB129), and the Scientific Research Foundation of Wuhan University of Technology (Grant No. 40120237 and 40120551).

Funders	Funder number
National Natural Science Foundation of China	52208124, 52278123
National Natural Science Foundation of China
Wuhan University of Technology	40120551, 40120237
Wuhan University of Technology
Hubei Provincial Key Research and Design Project	2020BAB129

Keywords

Thin heat pipe
Wick structure
Additive manufacturing
Heat transfer
Thermal management

ASJC Scopus subject areas

General Engineering

Access to Document

10.1016/j.applthermaleng.2024.125116

Cite this

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title = "High performance thin heat pipe: Recent advances in device designs and their applications in sustainable energy systems",

abstract = "Due to the limited surface area for heat dissipation, the increasing heat flux generated by modern electronics has become a significant challenge for engineering applications. Heat pipes (HPs) have been widely utilized in various scenarios for heat dissipation, owing to their high heat transfer performance, good stability, and long lifespan. The demand for developing thinner HPs has led to the exploration of novel techniques. This paper provides a comprehensive overview of strategies to improve the heat transfer performance of thin heat pipes (THPs), covering aspects such as HP types, materials, wick structures, and advanced manufacturing technologies. The characteristics of each wick structure are detailed and classified according to their spatial morphology. Additionally, the requirements for THPs vary across different application scenarios. The paper discusses the design and fabrication methods of THPs, focusing on ultra-thin HPs in smartphones and large-size THPs for engineering applications. The applicat",

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AU - Wu, Yongjia

AU - Liu, Dongyong

AU - Zhao, Sitong

AU - Zhao, Donghao

AU - Zhi, Congcong

AU - Pan, Yaoyu

AU - Fang, Yueping

AU - Zhou, Nan

AU - Ming, Tingzhen

PY - 2025/2/15

Y1 - 2025/2/15

N2 - Due to the limited surface area for heat dissipation, the increasing heat flux generated by modern electronics has become a significant challenge for engineering applications. Heat pipes (HPs) have been widely utilized in various scenarios for heat dissipation, owing to their high heat transfer performance, good stability, and long lifespan. The demand for developing thinner HPs has led to the exploration of novel techniques. This paper provides a comprehensive overview of strategies to improve the heat transfer performance of thin heat pipes (THPs), covering aspects such as HP types, materials, wick structures, and advanced manufacturing technologies. The characteristics of each wick structure are detailed and classified according to their spatial morphology. Additionally, the requirements for THPs vary across different application scenarios. The paper discusses the design and fabrication methods of THPs, focusing on ultra-thin HPs in smartphones and large-size THPs for engineering applications. The applicat

AB - Due to the limited surface area for heat dissipation, the increasing heat flux generated by modern electronics has become a significant challenge for engineering applications. Heat pipes (HPs) have been widely utilized in various scenarios for heat dissipation, owing to their high heat transfer performance, good stability, and long lifespan. The demand for developing thinner HPs has led to the exploration of novel techniques. This paper provides a comprehensive overview of strategies to improve the heat transfer performance of thin heat pipes (THPs), covering aspects such as HP types, materials, wick structures, and advanced manufacturing technologies. The characteristics of each wick structure are detailed and classified according to their spatial morphology. Additionally, the requirements for THPs vary across different application scenarios. The paper discusses the design and fabrication methods of THPs, focusing on ultra-thin HPs in smartphones and large-size THPs for engineering applications. The applicat

KW - Thin heat pipe

KW - Wick structure

KW - Additive manufacturing

KW - Heat transfer

KW - Thermal management

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High performance thin heat pipe: Recent advances in device designs and their applications in sustainable energy systems

Abstract

Bibliographical note

Funding

Keywords

ASJC Scopus subject areas

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