High performance thin heat pipe: Recent advances in device designs and their applications in sustainable energy systems

Due to the limited surface area for heat dissipation, the increasing heat flux generated by modern electronics has become a significant challenge for engineering applications. Heat pipes (HPs) have been widely utilized in various scenarios for heat dissipation, owing to their high heat transfer performance, good stability, and long lifespan. The demand for developing thinner HPs has led to the exploration of novel techniques. This paper provides a comprehensive overview of strategies to improve the heat transfer performance of thin heat pipes (THPs), covering aspects such as HP types, materials, wick structures, and advanced manufacturing technologies. The characteristics of each wick structure are detailed and classified according to their spatial morphology. Additionally, the requirements for THPs vary across different application scenarios. The paper discusses the design and fabrication methods of THPs, focusing on ultra-thin HPs in smartphones and large-size THPs for engineering applications. The applicat