Functionalised copper nanoparticles as catalysts for electroless plating

R.E. Litchfield, J. Graves, M. Sugden, D.A. Hutt, A. Cobley

    Research output: Chapter in Book/Report/Conference proceedingChapter

    7 Citations (Scopus)


    Electroless copper plating of insulating substrates, such as printed circuit boards, typically requires the pre-deposition of a catalyst layer onto the surface to initiate the chemical reactions. Pd/Sn based catalysts are widely used, but carry a high cost and in many cases require specialist pre-treatment of the substrate to achieve good adhesion. In this work, functionalised copper nanoparticles have been investigated as alternative catalysts for electroless deposition. Commercially available copper nanoparticles were functionalised with different organic molecules and their functionalisation was confirmed with X-ray photoelectron spectroscopy. The ability of these particles to act as a catalyst was demonstrated, however their effectiveness was found to depend on the nature of the organic molecules that were used in the functionalisation. Furthermore, significant variability was found between batches of samples in both the particle dispersion and attachment to the substrate surface, which affected the reproducibility of the coverage and adhesion of the subsequent electroless plating, for which further work is required to understand these effects
    Original languageEnglish
    Title of host publicationProceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
    VolumeArticle number 7028381
    ISBN (Print)978-147996994-4
    Publication statusPublished - 2014
    Event16th IEEE Electronics Packaging Technology Conference - , Singapore
    Duration: 3 Dec 20145 Dec 2014


    Conference16th IEEE Electronics Packaging Technology Conference
    Abbreviated titleEPTC 2014

    Bibliographical note

    This paper is not available on the repository. This paper was given at the 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014; Marina Bay SandsSingapore; Singapore; 3 December 2014 through 5 December 2014


    • Adhesion
    • Catalysts
    • Chip scale packages
    • Copper
    • Deposition
    • Electroless plating
    • Electronics packaging
    • Metal nanoparticles
    • Molecules
    • Nanoparticles
    • Palladium
    • Printed circuit boards
    • Printed circuits
    • Substrates
    • Alternative catalysts
    • Copper nanoparticles
    • Electroless copper plating
    • Insulating substrates
    • Organic molecules
    • Particle dispersion
    • Reproducibilities
    • Substrate surface


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