Formaldehyde free electroless copper compositions

A POOLE, MARK; J COBLEY, ANDREW; AMRIK SINGH,; V HIRST, DEBORAH

Formaldehyde free electroless copper compositions

A POOLE, MARK (Inventor), J COBLEY, ANDREW (Inventor), AMRIK SINGH, (Inventor), V HIRST, DEBORAH (Inventor)

School of Strategy and Leadership

Research output: Patent

Abstract

Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

Original language	English
Patent number	TW200809004
IPC	H05K 3/ 42 A I
Priority date	7/07/06
Publication status	Published - 16 Feb 2008

Access to Document

https://worldwide.espacenet.com/publicationDetails/biblio?II=0&ND=3&adjacent=true&locale=en_EP&FT=D&date=20080216&CC=TW&NR=200809004A&KC=A

Fingerprint Dive into the research topics of 'Formaldehyde free electroless copper compositions'. Together they form a unique fingerprint.

1 Patent

FORMALDEHYDE FREE ELECTROLESS COPPER COMPOSITION
POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 25 Apr 2013, IPC No. C23C 18/ 40 A I, Patent No. JP2013076171, Priority date 7 Jul 2006, Priority No. US20060819249P
Research output: Patent

Open Access

Cite this

@misc{819ea13cb5ef4aefb04ddc26999ddc46,

title = "Formaldehyde free electroless copper compositions",

abstract = "Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.",

author = "{POOLE, MARK}, A and {COBLEY, ANDREW}, J and AMRIK SINGH, and {HIRST, DEBORAH}, V",

year = "2008",

month = feb,

day = "16",

language = "English",

type = "Patent",

note = "TW200809004; H05K 3/ 42 A I",

}

TY - PAT

T1 - Formaldehyde free electroless copper compositions

AU - POOLE, MARK, A

AU - COBLEY, ANDREW, J

AU - SINGH,, AMRIK

AU - HIRST, DEBORAH, V

PY - 2008/2/16

Y1 - 2008/2/16

N2 - Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

AB - Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

M3 - Patent

M1 - TW200809004

ER -

Formaldehyde free electroless copper compositions

Abstract

Access to Document

FORMALDEHYDE FREE ELECTROLESS COPPER COMPOSITION

Cite this