Formaldehyde free electroless copper compositions

A POOLE, MARK (Inventor), J COBLEY, ANDREW (Inventor), AMRIK SINGH, (Inventor), V HIRST, DEBORAH (Inventor)

Research output: Patent

Abstract

Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

Original languageEnglish
Patent numberTW200809004
IPCH05K 3/ 42 A I
Priority date7/07/06
Publication statusPublished - 16 Feb 2008

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