FORMALDEHYDE FREE ELECTROLESS COPPER COMPOSITION

A POOLE MARK; J COBLEY ANDREW; AMRIK SINGH; V HIRST DEBORAH

FORMALDEHYDE FREE ELECTROLESS COPPER COMPOSITION

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

Research output: Patent

Abstract

PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition. ;SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates. ;COPYRIGHT: (C)2013,JPO&INPIT;PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition.SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

Original language	English
Patent number	JP2013076171
IPC	C23C 18/ 40 A I
Priority date	7/07/06
Publication status	Published - 25 Apr 2013

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1 Patent

Formaldehyde free electroless copper compositions
POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Feb 2008, IPC No. H05K 3/ 42 A I, Patent No. TW200809004, Priority date 7 Jul 2006, Priority No. US20060819249P
Research output: Patent

Open Access

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title = "FORMALDEHYDE FREE ELECTROLESS COPPER COMPOSITION",

abstract = "PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition. ;SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates. ;COPYRIGHT: (C)2013,JPO&INPIT;PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition.SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.",

author = "{POOLE MARK}, A and {COBLEY ANDREW}, J and AMRIK SINGH and {HIRST DEBORAH}, V",

year = "2013",

month = apr,

day = "25",

language = "English",

type = "Patent",

note = "JP2013076171; C23C 18/ 40 A I",

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TY - PAT

T1 - FORMALDEHYDE FREE ELECTROLESS COPPER COMPOSITION

AU - POOLE MARK, A

AU - COBLEY ANDREW, J

AU - SINGH, AMRIK

AU - HIRST DEBORAH, V

PY - 2013/4/25

Y1 - 2013/4/25

N2 - PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition. ;SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates. ;COPYRIGHT: (C)2013,JPO&INPIT;PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition.SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

AB - PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition. ;SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates. ;COPYRIGHT: (C)2013,JPO&INPIT;PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition.SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

M3 - Patent

M1 - JP2013076171

ER -

FORMALDEHYDE FREE ELECTROLESS COPPER COMPOSITION

Abstract

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Formaldehyde free electroless copper compositions

Cite this