FORMALDEHYDE FREE ELECTROLESS COPPER COMPOSITION

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

    Research output: Patent

    Abstract

    PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition. ;SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates. ;COPYRIGHT: (C)2013,JPO&INPIT;PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition.SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

    Original languageEnglish
    Patent numberJP2013076171
    IPCC23C 18/ 40 A I
    Priority date7/07/06
    Publication statusPublished - 25 Apr 2013

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  • Research Output

    Formaldehyde free electroless copper compositions

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Feb 2008, IPC No. H05K 3/ 42 A I, Patent No. TW200809004, Priority date 7 Jul 2006, Priority No. US20060819249P

    Research output: Patent

    Open Access
  • Cite this

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK., & HIRST DEBORAH, V. (2013). IPC No. C23C 18/ 40 A I. FORMALDEHYDE FREE ELECTROLESS COPPER COMPOSITION. (Patent No. JP2013076171).