Formaldehyde free electroless copper composition

A POOLE MARK; J COBLEY ANDREW; AMRIK SINGH; V HIRST DEBORAH

Formaldehyde free electroless copper composition

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

Research output: Patent

Abstract

PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition. ;SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates. ;COPYRIGHT: (C)2013,JPO&INPIT;PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition.SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

Original language	English
Patent number	JP2013076171A
IPC	C23C 18/40
Priority date	7/07/06
Filing date	23/01/13
Publication status	Published - 25 Apr 2013

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title = "Formaldehyde free electroless copper composition",

abstract = "PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition. ;SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates. ;COPYRIGHT: (C)2013,JPO&INPIT;PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition.SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.",

author = "{POOLE MARK}, A and {COBLEY ANDREW}, J and AMRIK SINGH and {HIRST DEBORAH}, V",

year = "2013",

month = apr,

day = "25",

language = "English",

type = "Patent",

note = "JP2013076171A; C23C 18/40",

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TY - PAT

T1 - Formaldehyde free electroless copper composition

AU - POOLE MARK, A

AU - COBLEY ANDREW, J

AU - SINGH, AMRIK

AU - HIRST DEBORAH, V

PY - 2013/4/25

Y1 - 2013/4/25

N2 - PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition. ;SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates. ;COPYRIGHT: (C)2013,JPO&INPIT;PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition.SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

AB - PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition. ;SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates. ;COPYRIGHT: (C)2013,JPO&INPIT;PROBLEM TO BE SOLVED: To provide a formaldehyde free electroless copper composition.SOLUTION: Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.

UR - https://patentimages.storage.googleapis.com/3c/b3/66/e206fd8f8659d5/JP2013076171A.pdf

M3 - Patent

M1 - JP2013076171A

Y2 - 2013/01/23

ER -

Formaldehyde free electroless copper composition

Abstract

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Formaldehyde free electroless copper compositions

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