Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications

Muhammad Zain-ul-abdein, Hassan Ijaz, Waqas Saleem, Kabeer Raza, Abdullah Salmeen Bin Mahfouz, Tarek Mabrouki

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)
24 Downloads (Pure)

Fingerprint

Dive into the research topics of 'Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications'. Together they form a unique fingerprint.

Material Science

Physics