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Experimental investigations on the effect of addition of Ag into ternary lead free solder alloy Sn-1Cu-1Ni
S. Jayesh
, J. Elias
Cochin University of Science and Technology
Research output
:
Contribution to journal
›
Article
›
peer-review
7
Citations (Scopus)
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Dive into the research topics of 'Experimental investigations on the effect of addition of Ag into ternary lead free solder alloy Sn-1Cu-1Ni'. Together they form a unique fingerprint.
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Weight
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Physics
Lead
100%
Alloy
100%
Melting Point
62%
Solder
50%
Microstructure
37%
Temperature
37%
Hardness
25%
High Temperature
12%
Region
12%
Value
12%
Amplitudes
12%
Tin
12%
Existence
12%
Wetting
12%
Particle
12%
Eutectics
12%
Joint
12%
View
12%
Distance
12%
Vibration
12%
Atoms
12%
Chemistry
Alloy
100%
Lead-Free Solder
100%
Melting Point
50%
Microstructure
37%
Hardness
25%
Wetting
25%
Tin
25%
Vibration
12%
Amount
12%
Eutectics
12%
Atom
12%
Toxicity
12%
Material Science
Lead-Free Solder
100%
Alloy
100%
Temperature
50%
Microstructure
25%
Hardness
25%
Soldering Alloys
12%
Contact Angle
12%
Microstructural Analysis
12%
Solder Joint
12%
Wetting
12%
Electronics
12%
Toxicity
12%
Particle
12%