Abstract
Lead is banned in alloy making citing toxicity concerns and environmental legislations. Researchers around the world were in search of new lead free solder alloys which could replace the old Sn–Pb alloy. Solder alloys are important electronic material used in electronics package industries. In this study, shear strength and impact toughness tests were conducted on Sn–0.5Cu–3Bi when different amounts of Ag (0.25, 0.5, 0.75, 1 wt%) is added. Shear strength test is done using micro force test system. Impact toughness test is done using Charpy impact test set up by finding the energy difference before and after impact. Ultimate shear stress is found to be increased from 17.3 to 23 MPa. Yield strength is found to be increased from 23.4 to 28 MPa. Impact toughness of the alloys increased from 10.4 to 11.3 J. EDAX analysis and mapping of the Sn–0.5Cu–3Bi–1Ag is also obtained Sn–0.5Cu–3Bi–1Ag is found to be having good improved shear strength and impact toughness than Sn–0.5Cu–3Bi.
| Original language | English |
|---|---|
| Pages (from-to) | 191-197 |
| Number of pages | 7 |
| Journal | Transactions on Electrical and Electronic Materials |
| Volume | 21 |
| Issue number | 2 |
| DOIs | |
| Publication status | Published - 3 Jan 2020 |
| Externally published | Yes |
Bibliographical note
Publisher Copyright:© 2020, The Korean Institute of Electrical and Electronic Material Engineers.
Keywords
- Electronic materials
- Impact toughness
- Lead-free
- Material property
- Shear strength
- Solder alloy
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering