Experimental Investigation on the Effect of Ag Addition on Ternary Lead Free Solder Alloy –Sn–0.5Cu–3Bi

Material Science

• Lead-Free Solder 100%
• Alloy 100%
• Soldering Alloys 60%
• Microstructure 60%
• Hardness 60%
• Silver 40%
• Field Emission Scanning Electron Microscopy 40%
• Contact Angle 40%
• Microhardness 20%
• Temperature 20%
• Chemical Composition Analysis 20%
• Gas 20%
• Surface 20%
• Argon 20%
• Toxicity 20%
• Material 20%

Chemistry

• Alloy 100%
• Lead-Free Solder 100%
• Hardness 60%
• Microstructure 60%
• Furnace 40%
• Melting Point 40%
• Wetting 40%
• Surface 20%
• Argon 20%
• Sample 20%
• Base 20%
• Microhardness 20%
• Gas 20%
• Toxicity 20%