Abstract
A new IGBT type structure, namely the p-ring FS+ Trench IGBT, with improved performance has been demonstrated. The improvement has been achieved through the utilization of p doped buried layers (p-rings) which allows for the simultaneous increase in the n enhancement layer doping concentration above the conventional levels without compromising the device breakdown rating. This unique lateral charge compensation approach is demonstrated to be highly effective in lowering the on-state losses. The experimental results show a 20% reduction in the on-state losses for a 1.7kV device.
Original language | English |
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Pages | 21-24 |
DOIs | |
Publication status | Published - 2015 |
Event | IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) - , Hong Kong Duration: 10 May 2015 → 14 May 2015 |
Conference
Conference | IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD) |
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Country/Territory | Hong Kong |
Period | 10/05/15 → 14/05/15 |
Bibliographical note
The full text is currently unavailable on the repository.Keywords
- buried layers
- charge compensation
- insulated gate bipolar transistors
- losses
- IGBT type structure
- conduction losses minimization design
- device breakdown rating
- enhancement layer doping concentration
- experimental demonstration
- lateral charge compensation approach
- on-state losses
- p doped buried layer utilization
- p-ring FS+ trench IGBT concept
- performance improvement
- voltage 1.7 kV
- Insulated Gate Bipolar Transistor (IGBT)
- superjunction power MOSFET
- technology trade-off
- Cathodes
- Doping
- Electric breakdown
- Insulated gate bipolar transistors
- Logic gates
- Performance evaluation
- Switches