Experimental and finite element analysis on determining the fatigue life of pb-free solder joint (Sn-0.5Cu-3Bi-1Ag) used in electronic packages under harmonic loads

S. Jayesh, Jacob Elias

Research output: Contribution to journalArticlepeer-review

2 Citations (Scopus)


Electronic packages that are used these days are exposed to different types of vibration loadings in their usage environment. This vibration exposure can be categorized as harmonic and random vibrations. When reliability assessment of modern electronic systems is considered, vibration loading has an important role to play. One of the biggest challenges facing today is the accurate and rapid assessment of fatigue life under the vibration loading. Conventional solder joints were made of lead-tin alloy. According to many environment legislations and rules, lead is prohibited as an ingredient in the solder alloy. The reason for the prohibition of the usage of the lead is that it poisons the environment. In this study, Sn-0.5Cu-3Bi-1Ag is used as the lead-free solder alloy. Fatigue life prediction of electronic package containing SAC405 is conducted with the aid of vibration testing and Finite element analysis under harmonic vibration loading. A specially designed Plastic Ball Grid Array Package (PBGA) component is mounted on Printed Circuit Board (PCB). It is taken as a test vehicle for the vibration test. The test vehicle is excited by a sinusoidal vibration. The frequency of this excitation equals the fundamental frequency of the test vehicle and it is continued till the component fails. Since the solder balls are very small for direct measurement, Finite Element analysis (FEA) is used for noting down the stresses. The stress versus failures cycles (S-N) curve is made by relating both the stresses on the solder balls obtained and the number of failure cycles from vibration analysis. The fatigue life of the component can be estimated from the generated S-N curve. It is analyzed that the methodology is effective in predicting the component's life. Hence, the reliability of electronic package can be improved.

Original languageEnglish
Article number2050020
JournalInternational Journal of Modeling, Simulation, and Scientific Computing
Issue number3
Publication statusPublished - 28 May 2020
Externally publishedYes

Bibliographical note

Publisher Copyright:
© 2020 World Scientific Publishing Company.


  • FEA
  • lead free solder joint
  • PBGA
  • PCB
  • S-N curve

ASJC Scopus subject areas

  • Modelling and Simulation
  • Computer Science Applications


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