Environmentally friendly electroless copper compositions

A POOLE, MARK (Inventor), J COBLEY, ANDREW (Inventor), AMRIK SINGH, (Inventor), V HIRST, DEBORAH (Inventor)

    Research output: Patent

    Abstract

    Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper on substrates.

    Original languageEnglish
    Patent numberTW200813255A
    IPCC23C 18/38,C23C 18/40
    Priority date7/07/06
    Filing date5/07/07
    Publication statusPublished - 16 Mar 2008

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    • Electroless copper compositions

      POOLE MARK, A. (Inventor), COBLEY ANDREW, J. (Inventor), SINGH, A. (Inventor) & HIRST DEBORAH, V. (Inventor), 14 Feb 2008, IPC No. C09D 5/00 , H05K 3/00, Patent No. US2008038452A1, 6 Jul 2007, Priority date 6 Jul 2007, Priority No. US20070825379

      Research output: Patent

      Open Access

    • Environmentally friendly electroless copper composition

      POOLE MARK, A. (Inventor), COBLEY ANDREW, J. (Inventor), SINGH, A. (Inventor) & HIRST DEBORAH, V. (Inventor), 24 Jul 2008, IPC No. H05K 3/42 , H05K 3/18, C23C 18/40, Patent No. JP2008169465A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819246P

      Research output: Patent

      Open Access

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