Environmentally friendly electroless copper compositions

A POOLE, MARK (Inventor), J COBLEY, ANDREW (Inventor), AMRIK SINGH, (Inventor), V HIRST, DEBORAH (Inventor)

Research output: Patent

Abstract

Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper on substrates.

Original languageEnglish
Patent numberTW200813255A
IPCC23C 18/38,C23C 18/40
Priority date7/07/06
Filing date5/07/07
Publication statusPublished - 16 Mar 2008

Other files and links

Fingerprint

Dive into the research topics of 'Environmentally friendly electroless copper compositions'. Together they form a unique fingerprint.
View full fingerprint

  • Electroless copper compositions

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 14 Feb 2008, IPC No. C09D 5/00 , H05K 3/00, Patent No. US2008038452A1, 6 Jul 2007, Priority date 6 Jul 2007, Priority No. US20070825379

    Research output: Patent

    Open Access

  • Environmentally friendly electroless copper composition

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 24 Jul 2008, IPC No. H05K 3/42 , H05K 3/18, C23C 18/40, Patent No. JP2008169465A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819246P

    Research output: Patent

    Open Access

Cite this