Environmentally friendly electroless copper composition

A POOLE MARK; J COBLEY ANDREW; AMRIK SINGH; V HIRST DEBORAH

Environmentally friendly electroless copper composition

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

School of Strategy and Leadership

Rohm and Haas Electronic Materials LLC

Research output: Patent

Abstract

PROBLEM TO BE SOLVED: To provide an electroless copper composition which does not contain formaldehyde and is environmentally friendly. ;SOLUTION: The composition contains one or more copper ion sources, one or more thiocarboxylic acids, glyoxylic acid and a salt thereof, and one or more alkaline compounds for keeping the composition alkaline. The thiocarboxylic acid includes a compound having the following formula: HS-(CX1)r-(CHX2)s-COOH (wherein X1 represents -H or -COOH; X2 represents -H or -SH; and r and s are positive integers while r is 0 to 2, or 0 or 1 and s is 1 or 2). The composition is used for electroless plating. ;COPYRIGHT: (C)2008,JPO&INPIT

Original language	English
Patent number	JP2008169465A
IPC	H05K 3/42 ,H05K 3/18,C23C 18/40
Priority date	7/07/06
Filing date	6/07/07
Publication status	Published - 24 Jul 2008

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title = "Environmentally friendly electroless copper composition",

abstract = "PROBLEM TO BE SOLVED: To provide an electroless copper composition which does not contain formaldehyde and is environmentally friendly. ;SOLUTION: The composition contains one or more copper ion sources, one or more thiocarboxylic acids, glyoxylic acid and a salt thereof, and one or more alkaline compounds for keeping the composition alkaline. The thiocarboxylic acid includes a compound having the following formula: HS-(CX1)r-(CHX2)s-COOH (wherein X1 represents -H or -COOH; X2 represents -H or -SH; and r and s are positive integers while r is 0 to 2, or 0 or 1 and s is 1 or 2). The composition is used for electroless plating. ;COPYRIGHT: (C)2008,JPO&INPIT",

author = "{POOLE MARK}, A and {COBLEY ANDREW}, J and AMRIK SINGH and {HIRST DEBORAH}, V",

year = "2008",

month = jul,

day = "24",

language = "English",

type = "Patent",

note = "JP2008169465A; H05K 3/42 ,H05K 3/18,C23C 18/40",

}

TY - PAT

T1 - Environmentally friendly electroless copper composition

AU - POOLE MARK, A

AU - COBLEY ANDREW, J

AU - SINGH, AMRIK

AU - HIRST DEBORAH, V

PY - 2008/7/24

Y1 - 2008/7/24

N2 - PROBLEM TO BE SOLVED: To provide an electroless copper composition which does not contain formaldehyde and is environmentally friendly. ;SOLUTION: The composition contains one or more copper ion sources, one or more thiocarboxylic acids, glyoxylic acid and a salt thereof, and one or more alkaline compounds for keeping the composition alkaline. The thiocarboxylic acid includes a compound having the following formula: HS-(CX1)r-(CHX2)s-COOH (wherein X1 represents -H or -COOH; X2 represents -H or -SH; and r and s are positive integers while r is 0 to 2, or 0 or 1 and s is 1 or 2). The composition is used for electroless plating. ;COPYRIGHT: (C)2008,JPO&INPIT

AB - PROBLEM TO BE SOLVED: To provide an electroless copper composition which does not contain formaldehyde and is environmentally friendly. ;SOLUTION: The composition contains one or more copper ion sources, one or more thiocarboxylic acids, glyoxylic acid and a salt thereof, and one or more alkaline compounds for keeping the composition alkaline. The thiocarboxylic acid includes a compound having the following formula: HS-(CX1)r-(CHX2)s-COOH (wherein X1 represents -H or -COOH; X2 represents -H or -SH; and r and s are positive integers while r is 0 to 2, or 0 or 1 and s is 1 or 2). The composition is used for electroless plating. ;COPYRIGHT: (C)2008,JPO&INPIT

UR - https://patentimages.storage.googleapis.com/03/36/38/4a4cad5f3f3525/JP2008169465A.pdf

M3 - Patent

M1 - JP2008169465A

Y2 - 2007/07/06

ER -

Environmentally friendly electroless copper composition

Abstract

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Environmentally friendly electroless copper compositions

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