Abstract
Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.
| Original language | English |
|---|---|
| Patent number | US2009004382 |
| IPC | B05D 7/22 |
| Priority date | 29/06/07 |
| Filing date | 29/06/07 |
| Publication status | Published - 1 Jan 2009 |