Electroless methods

A POOLE MARK; J COBLEY ANDREW; AMRIK SINGH; KEVIN BASS

Electroless methods

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), KEVIN BASS (Inventor)

School of Strategy and Leadership

Research output: Patent

Abstract

Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.

Original language	English
Patent number	US2009004382
IPC	B05D 7/ 22 A I
Priority date	29/06/07
Publication status	Published - 1 Jan 2009

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POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK., & BASS, KEVIN. (2009). IPC No. B05D 7/ 22 A I. Electroless methods. (Patent No. US2009004382).

@misc{c33580c78ab349a6bad1c94075588020,

title = "Electroless methods",

abstract = "Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.",

author = "{POOLE MARK}, A and {COBLEY ANDREW}, J and AMRIK SINGH and KEVIN BASS",

year = "2009",

month = "1",

day = "1",

language = "English",

type = "Patent",

note = "US2009004382; B05D 7/ 22 A I",

}

TY - PAT

T1 - Electroless methods

AU - POOLE MARK, A

AU - COBLEY ANDREW, J

AU - SINGH, AMRIK

AU - BASS, KEVIN

PY - 2009/1/1

Y1 - 2009/1/1

N2 - Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.

AB - Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.

M3 - Patent

M1 - US2009004382

ER -