Abstract
Methods of electroless metallalization are disclosed. The methods include treating through-holes of printed wiring boards to increase catalyst adsorption on the walls of the through-holes. The increased catalyst adsorption improves electroless metallization of the through-hole walls.
Original language | English |
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Patent number | US2009004382 |
IPC | B05D 7/22 |
Priority date | 29/06/07 |
Filing date | 29/06/07 |
Publication status | Published - 1 Jan 2009 |