ELECTROLESS COPPER PLATING BATH AND REDOX COUPLE

Mark A Poole (Inventor), Andrew Cobley (Inventor), Amrik Singh (Inventor), Deborah V Hirst (Inventor)

Research output: Patent

Abstract

PROBLEM TO BE SOLVED: To provide an electroless copper plating bath which does not contain formaldehyde, is stable, deposits an acceptable level of a copper deposit and is friendly to the environment. ;SOLUTION: This electroless copper plating bath has a composition including one or more copper ion sources, one or more chelating agents selected from hydantoin and a hydantoin derivative, and one or more redox couples. The hydantoin derivative is selected from among 1-methyl hydantoin, 1,3-dimethylhydantoin and 5,5-dimethylhydantoin. ;COPYRIGHT: (C)2008,JPO&INPIT

Original languageEnglish
Patent numberJP2008101268
IPCH05K 3/ 18 A I
Priority date7/07/06
Publication statusPublished - 1 May 2008

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  • ELECTROLESS COPPER AND REDOX COUPLE

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 22 Aug 2013, IPC No. H05K 3/ 42 A I, Patent No. JP2013163867, Priority date 7 Jul 2006, Priority No. US20060819250P

    Research output: Patent

    Open Access

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