Electroless Copper Plating Bath And Redox Couple

Mark A Poole; Andrew Cobley; Amrik Singh; Deborah V Hirst

Electroless Copper Plating Bath And Redox Couple

Mark A Poole (Inventor), Andrew Cobley (Inventor), Amrik Singh (Inventor), Deborah V Hirst (Inventor)

Coventry University

Rohm and Haas Electronic Materials LLC

Research output: Patent

Abstract

PROBLEM TO BE SOLVED: To provide an electroless copper plating bath which does not contain formaldehyde, is stable, deposits an acceptable level of a copper deposit and is friendly to the environment. ;SOLUTION: This electroless copper plating bath has a composition including one or more copper ion sources, one or more chelating agents selected from hydantoin and a hydantoin derivative, and one or more redox couples. The hydantoin derivative is selected from among 1-methyl hydantoin, 1,3-dimethylhydantoin and 5,5-dimethylhydantoin. ;COPYRIGHT: (C)2008,JPO&INPIT

Original language	English
Patent number	JP2008101268A
IPC	H05K 3/18,C23C 18/40
Priority date	7/07/06
Filing date	6/07/07
Publication status	Published - 1 May 2008

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2 Patent

Electroless copper and redox couple
POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 22 Aug 2013, IPC No. H05K 3/42, C23C 18/40, H05K3/18, Patent No. JP2013163867A, 16 May 2013, Priority date 7 Jul 2006, Priority No. US20060819250P
Research output: Patent
Electroless copper and redox couples
POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/18 , C23C 18/38, C23C 18/40, Patent No. TW200813253A, 2 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819250P
Research output: Patent

Open Access

Cite this

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title = "Electroless Copper Plating Bath And Redox Couple",

abstract = "PROBLEM TO BE SOLVED: To provide an electroless copper plating bath which does not contain formaldehyde, is stable, deposits an acceptable level of a copper deposit and is friendly to the environment. ;SOLUTION: This electroless copper plating bath has a composition including one or more copper ion sources, one or more chelating agents selected from hydantoin and a hydantoin derivative, and one or more redox couples. The hydantoin derivative is selected from among 1-methyl hydantoin, 1,3-dimethylhydantoin and 5,5-dimethylhydantoin. ;COPYRIGHT: (C)2008,JPO&INPIT",

author = "Poole, {Mark A} and Andrew Cobley and Amrik Singh and Hirst, {Deborah V}",

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T1 - Electroless Copper Plating Bath And Redox Couple

AU - Poole, Mark A

AU - Cobley, Andrew

AU - Singh, Amrik

AU - Hirst, Deborah V

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Y1 - 2008/5/1

N2 - PROBLEM TO BE SOLVED: To provide an electroless copper plating bath which does not contain formaldehyde, is stable, deposits an acceptable level of a copper deposit and is friendly to the environment. ;SOLUTION: This electroless copper plating bath has a composition including one or more copper ion sources, one or more chelating agents selected from hydantoin and a hydantoin derivative, and one or more redox couples. The hydantoin derivative is selected from among 1-methyl hydantoin, 1,3-dimethylhydantoin and 5,5-dimethylhydantoin. ;COPYRIGHT: (C)2008,JPO&INPIT

AB - PROBLEM TO BE SOLVED: To provide an electroless copper plating bath which does not contain formaldehyde, is stable, deposits an acceptable level of a copper deposit and is friendly to the environment. ;SOLUTION: This electroless copper plating bath has a composition including one or more copper ion sources, one or more chelating agents selected from hydantoin and a hydantoin derivative, and one or more redox couples. The hydantoin derivative is selected from among 1-methyl hydantoin, 1,3-dimethylhydantoin and 5,5-dimethylhydantoin. ;COPYRIGHT: (C)2008,JPO&INPIT

M3 - Patent

M1 - JP2008101268A

Y2 - 2007/07/06

ER -

Electroless Copper Plating Bath And Redox Couple

Abstract

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Research output

Electroless copper and redox couple

Electroless copper and redox couples

Cite this