Electroless copper compositions

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

    Research output: Patent

    Abstract

    Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

    Original languageEnglish
    Patent numberUS2008038452A1
    IPCC09D 5/00 ,H05K 3/00
    Priority date6/07/07
    Filing date6/07/07
    Publication statusPublished - 14 Feb 2008

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    • Environmentally friendly electroless copper compositions

      POOLE, MARK, A. (Inventor), COBLEY, ANDREW, J. (Inventor), SINGH, A. (Inventor) & HIRST, DEBORAH, V. (Inventor), 16 Mar 2008, IPC No. C23C 18/38, C23C 18/40, Patent No. TW200813255A, 5 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819246P

      Research output: Patent

    • Formaldehyde free electroless copper compositions

      POOLE, MARK, A. (Inventor), COBLEY, ANDREW, J. (Inventor), SINGH, A. (Inventor) & HIRST, DEBORAH, V. (Inventor), 16 Feb 2008, IPC No. H05K 3/42 , C23C 18/38, Patent No. TW200809004A, 2 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819249P

      Research output: Patent

      Open Access

    • Improved electroless copper compositions

      POOLE, MARK, A. (Inventor), COBLEY, ANDREW, J. (Inventor), SINGH, A. (Inventor) & HIRST, DEBORAH, V. (Inventor), 16 Mar 2008, IPC No. H05K 3/18 , C23C 18/40, Patent No. TW200813254A, 5 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819247P

      Research output: Patent

      Open Access

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