Electroless copper compositions

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

Research output: Patent

Abstract

Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

Original languageEnglish
Patent numberUS2008038452A1
IPCC09D 5/00 ,H05K 3/00
Priority date6/07/07
Filing date6/07/07
Publication statusPublished - 14 Feb 2008

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  • Environmentally friendly electroless copper compositions

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. C23C 18/38, C23C 18/40, Patent No. TW200813255A, 5 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819246P

    Research output: Patent

  • Formaldehyde free electroless copper compositions

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Feb 2008, IPC No. H05K 3/42 , C23C 18/38, Patent No. TW200809004A, 2 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819249P

    Research output: Patent

    Open Access

  • Improved electroless copper compositions

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/18 , C23C 18/40, Patent No. TW200813254A, 5 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819247P

    Research output: Patent

    Open Access

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