Electroless copper compositions

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

Research output: Patent

Abstract

Electroless copper and copper alloys plating baths are disclosed. The electroless baths are formaldehyde and are environmentally friendly. The electroless baths are stable and deposit a bright or copper alloy on substrates.

Original languageEnglish
Patent numberUS2008038452
IPCC09D 5/ 00 A I
Priority date6/07/07
Publication statusPublished - 14 Feb 2008

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    • Research Output

    Improved electroless copper compositions

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/ 18 A I, Patent No. TW200813254, Priority date 7 Jul 2006, Priority No. US20060819247P

    Research output: Patent

    Open Access

    • Cite this

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK., & HIRST DEBORAH, V. (2008). IPC No. C09D 5/ 00 A I. Electroless copper compositions. (Patent No. US2008038452).