Electroless copper and redox couples

A POOLE, MARK (Inventor), J COBLEY, ANDREW (Inventor), AMRIK SINGH, (Inventor), V HIRST, DEBORAH (Inventor)

Research output: Patent

Abstract

Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.

Original languageEnglish
Patent numberTW200813253A
IPCH05K 3/18 ,C23C 18/38,C23C 18/40
Priority date7/07/06
Filing date2/07/07
Publication statusPublished - 16 Mar 2008

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  • Electroless copper and redox couple

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 22 Aug 2013, IPC No. H05K 3/42, C23C 18/40, H05K3/18, Patent No. JP2013163867A, 16 May 2013, Priority date 7 Jul 2006, Priority No. US20060819250P

    Research output: Patent

  • Electroless Copper Plating Bath And Redox Couple

    Poole, M. A., Cobley, A., Singh, A. & Hirst, D. V., 1 May 2008, IPC No. H05K 3/18, C23C 18/40, Patent No. JP2008101268A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819250P

    Research output: Patent

    Open Access

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