Electroless copper and redox couples

A POOLE, MARK (Inventor), J COBLEY, ANDREW (Inventor), AMRIK SINGH, (Inventor), V HIRST, DEBORAH (Inventor)

Research output: Patent

Abstract

Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.

Original languageEnglish
Patent numberTW200813253
IPCH05K 3/ 18 A I
Priority date7/07/06
Publication statusPublished - 16 Mar 2008

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  • Research Output

    ELECTROLESS COPPER AND REDOX COUPLE

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK. & HIRST DEBORAH, V., 22 Aug 2013, IPC No. H05K 3/ 42 A I, Patent No. JP2013163867, Priority date 7 Jul 2006, Priority No. US20060819250P

    Research output: Patent

    Open Access
  • Cite this

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK., & HIRST, DEBORAH, V. (2008). IPC No. H05K 3/ 18 A I. Electroless copper and redox couples. (Patent No. TW200813253).