Electroless copper and redox couple

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

    Research output: Patent

    Abstract

    PROBLEM TO BE SOLVED: To provide an electroless copper bath which is free of formaldehyde and is stable, provides acceptable copper deposits and is environmentally friendly.SOLUTION: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.

    Original languageEnglish
    Patent numberJP2013163867A
    IPCH05K 3/42,C23C 18/40,H05K3/18
    Priority date7/07/06
    Filing date16/05/13
    Publication statusPublished - 22 Aug 2013

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    • Electroless copper and redox couples

      POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/18 , C23C 18/38, C23C 18/40, Patent No. TW200813253A, 2 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819250P

      Research output: Patent

      Open Access

    • Electroless Copper Plating Bath And Redox Couple

      Poole, M. A., Cobley, A., Singh, A. & Hirst, D. V., 1 May 2008, IPC No. H05K 3/18, C23C 18/40, Patent No. JP2008101268A, 6 Jul 2007, Priority date 7 Jul 2006, Priority No. US20060819250P

      Research output: Patent

      Open Access

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