ELECTROLESS COPPER AND REDOX COUPLE

A POOLE MARK (Inventor), J COBLEY ANDREW (Inventor), AMRIK SINGH (Inventor), V HIRST DEBORAH (Inventor)

    Research output: Patent

    Abstract

    PROBLEM TO BE SOLVED: To provide an electroless copper bath which is free of formaldehyde and is stable, provides acceptable copper deposits and is environmentally friendly.SOLUTION: Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.

    Original languageEnglish
    Patent numberJP2013163867
    IPCH05K 3/ 42 A I
    Priority date7/07/06
    Publication statusPublished - 22 Aug 2013

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    • Research Output

    Electroless copper and redox couples

    POOLE, MARK, A., COBLEY, ANDREW, J., SINGH, AMRIK. & HIRST, DEBORAH, V., 16 Mar 2008, IPC No. H05K 3/ 18 A I, Patent No. TW200813253, Priority date 7 Jul 2006, Priority No. US20060819250P

    Research output: Patent

    Open Access

    • ELECTROLESS COPPER PLATING BATH AND REDOX COUPLE

    Poole, M. A., Cobley, A., Singh, A. & Hirst, D. V., 1 May 2008, IPC No. H05K 3/ 18 A I, Patent No. JP2008101268, Priority date 7 Jul 2006, Priority No. US20060819250P

    Research output: Patent

    Open Access

    • Cite this

    POOLE MARK, A., COBLEY ANDREW, J., SINGH, AMRIK., & HIRST DEBORAH, V. (2013). IPC No. H05K 3/ 42 A I. ELECTROLESS COPPER AND REDOX COUPLE. (Patent No. JP2013163867).