Effect of the Filling Liquid Ratio on the Thermal Performance of a Novel Thermal Diode with Wick

Zhiyong Li, Tingzhen Ming, Heyu Zhang, Sitong Zhao, Qinggang Wang, Cunjin Cai, Kui Yin, Yueping Fang, Yongjia Wu

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

The application of thermal diodes, which allow heat to flow more readily in one direction than the other, is an important way to reduce energy consumption in buildings and enhance the battery heat dissipation of electric vehicles. Depending on various factors including the specific design, materials used, and operating conditions, the convective thermal diode can exhibit the best thermal rectification effect in intended applications compared to the other thermal diodes. In this study, a novel convective thermal diode with a wick was proposed based on the phase change heat transfer mechanism. This design takes advantage of both capillary forces provided by the wick and gravity to achieve enhanced unidirectional heat transfer performance for the designed convective thermal diode. The effect of the filling liquid ratio on the thermal performance of the thermal diode was experimentally investigated, which was in good agreement with the theoretical analysis. The research findings showed that with an optimal liquid filling ratio of 140%, the thermal diode with a wick can achieve a better thermal rectification ratio when subjected to a lower heating power, and the maximum thermal rectification ratio of 21.76 was experimentally achieved when the heating power of the thermal diode was 40 W.
Original languageEnglish
Pages (from-to)396-407
Number of pages12
JournalJournal of Thermal Science
Volume33
Issue number2
DOIs
Publication statusPublished - 2 Mar 2024

Funder

This research was supported by the National Natural Science Foundation of China (Grant No. 52208124), Hubei Provincial Key Research and Design Project (Grant No. 2020BAB129), and Scientific Research Foundation of Wuhan University of Technology (Grant No. 40120237 and 40120551).

Funding

This research was supported by the National Natural Science Foundation of China (Grant No. 52208124), Hubei Provincial Key Research and Design Project (Grant No. 2020BAB129), and Scientific Research Foundation of Wuhan University of Technology (Grant No. 40120237 and 40120551).

FundersFunder number
Hubei Provincial Key Research and Design Project2020BAB129
Wuhan University of Technology40120551, 40120237
National Natural Science Foundation of China52208124

    Keywords

    • filling liquid ratio
    • thermal diode
    • wick structure
    • gravity

    ASJC Scopus subject areas

    • General Energy
    • General Engineering

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